In some embodiments, an apparatus comprises a biosensing garment and an electronics assembly. The biosensing garment includes a sensor, a conductive pathway, and a connection region including one or more connectors that are disposed on a PCB. The connection region is electrically coupled to the conductive pathway and the sensor. The connection region is further configured to be electronically coupled to the electronics assembly via at least one conductive contact. In some embodiments, the electronics assembly includes at least one conductive contact that is configured to be electronically coupled to at least one portion of the PCB.

A dielectric composite is provided. The dielectric composite includes:

at least one first dielectric layer; and
at least one second dielectric layer,
wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than 150 ppm/ C., and the second dielectric layer has a TCDK not lower than 50 ppm/ C.; and
the dielectric composite has a dielectric constant (Dk) not lower than 4, and a TCDk ranging from 0 to 150 ppm/ C.

A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.

There is provided a circuit board including a laminated structure, a plurality of dielectric layers and a plurality of conductive layers. A connector and a circuit to which a signal is input via the connector are attached to a first conductive layer arranged on an outermost side of the circuit board. The first conductive layer includes a space between a first area in which the first conductive layer and an exterior of the connector are electrically connected and a second area in which the first conductive layer and the circuit are electrically connected, and at least one conductive layer different from the first conductive layer does not have a space between an area in which the at least one conductive layer is electrically connected to the first area and an area in which the at least one conductive layer is electrically connected to the second area.

In some embodiments, an apparatus comprises a biosensing garment and an electronics assembly. The biosensing garment includes a sensor, a conductive pathway, and a connection region including one or more connectors that are disposed on a PCB. The connection region is electrically coupled to the conductive pathway and the sensor. The connection region is further configured to be electronically coupled to the electronics assembly via at least one conductive contact. In some embodiments, the electronics assembly includes at least one conductive contact that is configured to be electronically coupled to at least one portion of the PCB.

A method for producing a via-filled substrate includes a metal film forming step of forming a metal film containing an active metal on a hole part wall surface of an insulating substrate having a hole part, a filling step of filling a conductor paste having a volume change rate before and after firing of 10 to 20% in the hole part in which the metal film is formed, and a firing step of firing the insulating substrate in which the conductor paste is filled.

A printed circuit board includes a circuit substrate and a plurality of buffering circuits. The circuit substrate includes a substrate layer, and first and second circuit layers formed on either side of the substrate layer. The first circuit layer comprises a plurality of first conductive circuits. The second circuit layer comprises a plurality of second conductive circuits. A line width of each of the plurality of first conductive circuits is greater than a line width of each of the plurality of second conductive circuits. The plurality of buffering circuits electrically connect the first circuit layer to the second circuit layer and a line width of each of the plurality of buffering circuits is greater than the line width of each of the plurality of second conductive circuits.

In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

A UWB band pass filter that is formed by a circuit board. The circuit board includes a first dielectric layer made of a dielectric substrate, a filter structure made of electrically conductive material, on a first side of the first dielectric layer, a first ground layer made of electrically conductive material, on a second side of the first dielectric layer. The filter structure has an input terminal and an output terminal between which a line extends that includes multiple first line sections and second line sections, and wherein the filter structure has multiple stubs that are situated between the first line sections and that branch off from the second line sections. The first line sections and the stubs are situated in parallel. The longitudinal line of the middle first line sections is inserted, from which two open stubs that are rotationally symmetrical about the middle first line sections branch off.

A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.