The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

The present disclosure provides an electronic device. The electronic device includes a substrate, an electronic component, a circuit structure, and a shielding layer. The electronic component is disposed under the substrate. The circuit structure is disposed under the substrate. The shielding layer is disposed under the substrate and covers the electronic component and connected to the circuit structure. The circuit structure and the shielding layer are collectively configured to block the electronic component from electromagnetic interference.

A printed circuit board includes a substrate having first and second external portions opposite to each other in a length direction, a first insulating layer disposed on an upper side of the substrate, a second insulating layer disposed on a lower side of the substrate, a first insulating material covering at least a portion of the first external portion of the substrate, and a second insulating material covering at least a portion of the second external portion of the substrate. The first and second insulating layers respectively have a coefficient of thermal expansion higher than that of the substrate. The first and second insulating materials respectively have a coefficient of thermal expansion lower than that of the substrate.

A carrier board includes a substrate having a first substrate surface, a second substrate surface, and a substrate hole that penetrates the first substrate surface and the second substrate surface; a magnet sheath disposed in the substrate hole to cover a hole boundary of the substrate hole, and including a first magnetic surface, a second magnetic surface, and an inner periphery that interconnects the first magnetic surface and the second magnetic surface; a first dielectric isolation layer and a second dielectric isolation layer respectively having outer surfaces facing away from the substrate; and a conductive metal layer covering the inner periphery of the magnet sheath and extending to overlie the outer surfaces of the first dielectric isolation layer and the second dielectric isolation layer.

According to embodiments of the present disclosure, a laminated unit for a printed circuit board and a printed circuit board are provided. The laminated unit includes a plurality of metal layers and a plurality of dielectric layers alternately stacked in a thickness direction, wherein the plurality of metal layers include a signal transmission layer and a pair of reference layers disposed on two sides of the signal transmission layer; at least one of two dielectric layers adjacent to the signal transmission layer is arranged as a resin isolation layer; and the dielectric layers on sides of the pair of reference layers opposite to the signal transmission layer are arranged as reinforcing layers, and the reinforcing layers include a substrate and a resin material arranged around the substrate.

A wiring circuit board includes a first insulating layer, a circuit pattern, a second insulating layer, and a third insulating layer. The circuit pattern includes a first terminal, a first wire connected to the first terminal, and a second terminal spaced apart from the first terminal. The first wire includes a first body portion covered with the second insulating layer, and a first exposed portion disposed between the first terminal and the first body portion and exposed from the second insulating layer. The third insulating layer is disposed between the first exposed portion and the second terminal, and is disposed between the first terminal and the second terminal.

According to embodiments of the present disclosure, a laminated unit for a printed circuit board and a printed circuit board are provided. The laminated unit includes a plurality of metal layers and a plurality of dielectric layers alternately stacked in a thickness direction, wherein the plurality of metal layers include a signal transmission layer and a pair of reference layers disposed on two sides of the signal transmission layer; at least one of two dielectric layers adjacent to the signal transmission layer is arranged as a resin isolation layer; and the dielectric layers on sides of the pair of reference layers opposite to the signal transmission layer are arranged as reinforcing layers, and the reinforcing layers include a substrate and a resin material arranged around the substrate.

A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.

A circuit board structure includes a core, a wiring layer and a buried passive component. The wiring layer and the buried passive component are disposed on the core, and the buried passive component is electrically connected to the wiring layer. The buried passive component includes a first spiral metal layer, a second spiral metal layer and a dielectric interlayer. The first spiral metal layer is intertwined with the second spiral metal layer. The dielectric interlayer is disposed between the first spiral metal layer and the second spiral metal layer. The first spiral metal layer and the second spiral metal layer are spaced apart by the dielectric interlayer at least in the core.

A UWB band pass filter that is formed by a circuit board. The circuit board includes a first dielectric layer made of a dielectric substrate, a filter structure made of electrically conductive material, on a first side of the first dielectric layer, a first ground layer made of electrically conductive material, on a second side of the first dielectric layer. The filter structure has an input terminal and an output terminal between which a line extends that includes multiple first line sections and second line sections, and wherein the filter structure has multiple stubs that are situated between the first line sections and that branch off from the second line sections. The first line sections and the stubs are situated in parallel. The longitudinal line of the middle first line sections is inserted, from which two open stubs that are rotationally symmetrical about the middle first line sections branch off.