Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

The present invention provides to a wearable smart device having electrical wiring comprising a stretchable conductive composition having excellent in durability such as repeated bending properties and repeated twisting properties, a material for realizing the wearable smart device, and a method for producing the wearable start device.

An electrical wiring including a fine line having an electrical line interval of 1 mm or less, preferably the line width of less than 1 mm, is formed by printing a paste for forming a stretchable conductor containing metal-based conductive particles and a non-crosslinked elastomer, and further dried and cured at a low temperature condition of 120 C. for 30 minutes. As a result, the wearable smart device having electrical wiring constituted by fine lines without sagging of the edge is obtained.

A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

An electronic component package according to an embodiment includes a circuit board including an insulating layer, a circuit wiring disposed inside the insulating layer, a plurality of first conductive pads disposed in a first region on the insulating layer and connected to the circuit wiring, an auxiliary pad disposed over the first conductive pad and having a diameter smaller than that of the first conductive pad, and a solder resist layer disposed over the insulating layer, having a first opening overlapping the first region, and spaced apart from the auxiliary pad; an electronic component spaced apart from the solder resist layer and disposed over the first opening; and a conductive adhesive member electrically connecting the auxiliary pad and the electronic component.

One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150 C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a magnetic particle embedded flexible substrate, a printed flexible substrate for a magnetic tray, or an electro-magnetic carrier for magnetized or ferromagnetic flexible substrates. For instance, in accordance with one embodiment, there are means disclosed for fabricating a flexible substrate having one or more electrical interconnects to couple with leads of an electrical device; integrating magnetic particles or ferromagnetic particles into the flexible substrate; supporting the flexible substrate with a carrier plate during one or more manufacturing processes for the flexible substrate, in which the flexible substrate is held flat against the carrier plate by an attractive magnetic force between the magnetic particles or ferromagnetic particles integrated with the flexible substrate and a complementary magnetic attraction of the carrier plate; and removing the flexible substrate from the carrier plate subsequent to completion of the one or more manufacturing processes for the flexible substrate. Other related embodiments are disclosed.

A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.