A circuit board according to an embodiment includes an insulating layer; and a via portion disposed in a via hole formed in the insulating layer; wherein the via portion includes: a first pad disposed on a lower surface of the insulating layer; a second pad disposed on an upper surface of the insulating layer; a third pad disposed in the via hole and disposed on the first pad; and a connection portion disposed in the via hole and disposed between the second pad and the third pad.

The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.

A glass composition for glass fiber to achieve both high elastic modulus and low coefficient of linear thermal expansion and that enables molten glass with excellent compositional uniformity and clarity. The glass composition for glass fiber includes 42.00 to 70.00% by mass of SiO.sub.2, 10.00 to 30.00% by mass of Al.sub.2O.sub.3, 0.00 to 8.00% by mass of MgO, 0.00 to 5.00% by mass of CaO, 2.00 to 25.00% by mass of ZnO, 0.00 to 5.00% by mass of TiO.sub.2, 2.00 to 17.30% by mass of P.sub.2O.sub.5, and 0.01 to 2.00% by mass in total of MxOy (one or more oxides selected from Fe.sub.2O.sub.3, SnO.sub.2, CeO.sub.2, MnO.sub.2, Sb.sub.2O.sub.3, and As.sub.2O.sub.3), with respect to the total amount, and the content Z of ZnO, the content P of P.sub.2O.sub.5, and the content M of MxOy satisfy the following formula (1): 0.088(Z/P)M.sup.1/23.554 . . . (1).

A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a fourth insulating layer embedded in the third insulating layer; and a fifth insulating layer disposed on the third insulating layer, wherein the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer are provided with different materials, wherein the second insulating layer and the fifth insulating layer are provided with a same material, and a thickness in a vertical direction between an upper surface of the fourth insulating layer and an upper surface of the third insulating layer is smaller than a thickness of the second insulating layer in the vertical direction.

An electronic device is provided having a device part; an outer housing is provided to cover an upper side of the device part; and the electronic device also has a fiber member for joining the device part to the outer housing. The fiber member is exposed from an upper surface of the outer housing.

According to various embodiments, a flexible printed circuit board includes: a first flexible dielectric layer that includes reinforcing fibers; a second flexible dielectric layer that includes no reinforcing fibers; and a first conductive layer that is disposed between the first dielectric layer and the second dielectric layer and contacts the first dielectric layer and the second dielectric layer.

A printed circuit board includes a bendable portion. The bendable portion is bendable in a bending direction in plan view and has a first dielectric layer, a signal pattern, a second dielectric layer, a cloth, and a ground pattern. The first dielectric layer has a first main surface. The signal pattern is arranged on the first main surface. The second dielectric layer has a second main surface and a third main surface opposite to the second main surface, and the second main surface is arranged to face the first main surface. The cloth includes a plurality of first reinforced fibers extending in a first direction in plan view and a plurality of second reinforced fibers extending in a second direction inclined with respect to the first direction in plan view, the plurality of first reinforced fibers and the plurality of second reinforced fibers being knitted together in a cloth form.

An electrical device having a component which is at least partially covered with a gel, and a printed circuit board having an end face, on which a metal layer is applied, which metal layer covers the end face at least partially. The metal layer is at least partially covered by the gel, and the metal layer physically insulates the end face from the gel completely.