Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

The present invention provides a light-transmitting conductor comprising: a substrate; and a conduction layer on the substrate, wherein the conduction layer comprises a conductive material, and the conduction layer has a pattern corresponding to a network formed such that nanostructures are arranged to intersect with each other that includes a substrate and a conduction layer on the substrate.

A stress and/or strain indicator comprises a wearable body, one or more flexible sections, one or more rigid sections and one or more strain gauges. The one or more strain gauges detect a level of stress and/or strain applied to the wearable body in order to indicate when the product is in danger of failing. A warning is activated based upon the level of stress and/or strain applied to the wearable body. For example, the stress and/or strain indicator is able to display a visual and/or an audible warning that a high level of stress and/or strain has been applied to the wearable body and the product is in danger of failing. In some embodiments, the stress and/or strain incident is recorded and downloadable. Consequently, a user is better informed as to when the electronic product is in danger of failing because of damage or misuse.

Detection column wires and detection row wires are configured of thin wires made of a conductive material having light reflectivity, such as a metal or alloy including silver and aluminum. A predetermined plural number of detection column wires are electrically connected to form a plurality of column-direction bundle wires. A predetermined plural number of detection row wires are electrically connected to form a plurality of row-direction bundle wires. A reflected-light distribution pattern is further provided. When viewed in a direction vertical to the surface of the touch screen, the reflected-light distribution pattern includes a curved portion, and the normal lines of the curved portion head for all directions.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer.

Detection column wires and detection row wires are configured of thin wires made of a conductive material having light reflectivity, such as a metal or alloy including silver and aluminum. A predetermined plural number of detection column wires are electrically connected to form a plurality of column-direction bundle wires. A predetermined plural number of detection row wires are electrically connected to form a plurality of row-direction bundle wires. A reflected-light distribution pattern is further provided. When viewed in a direction vertical to the surface of the touch screen, the reflected-light distribution pattern includes a curved portion, and the normal lines of the curved portion head for all directions.

The present disclosure provides an elastic interposer including a flexible substrate and a conductive device. The flexible substrate includes multiple circuits, of which first terminals are exposed on a first surface of the flexible substrate and show a first pattern, and of which second terminals are exposed on a second surface of the flexible substrate and show a second pattern different from the first pattern. The conductive device includes a first flexible conductive element and a second flexible conductive element. The first flexible conductive element is disposed on the first surface of the flexible substrate, and includes multiple first elastic conductive portions electrically connected to the first terminals of the circuits. The second flexible conductive element is disposed on the second surface of the flexible substrate, and includes multiple second elastic conductive portions electrically connected to the second terminals of the circuits.

An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

A conductive particle including a base particle and a conductive portion disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 m or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are performed once is 1.5 or less.