A sensor driving device is provided. A sensor driving device according to one aspect of the present invention comprises: a first substrate; a second substrate disposed on the first substrate and electrically connected to the first substrate; and an image sensor disposed on the second substrate, wherein the second substrate comprises a body and a first protrusion part protruding from one end of the body, and the first protrusion part comprises a first extension part extending in a first direction from the body, and a second extension part extending in a second direction that differs from the first direction from the first extension part.

A flexible circuit board includes a first substrate, display panel signal traces, a touch chip, at least one second substrate, a touch auxiliary device, first touch signal traces and at least one second touch signal trace. The display panel signal traces, the touch chip and the at least one second substrate are located on the same side of the first substrate; and the touch auxiliary device is located on a second substrate. The first touch signal trace includes a first connection trace and a first transfer trace that are electrically connected to each other. The second touch signal trace includes a second connection trace and a second transfer trace that are electrically connected to each other. The first connection trace and the second connection trace are disposed on the first substrate, and the first transfer trace and the second transfer trace are disposed on the at least one second substrate.

A circuit board assembly and electronic device are provided that improve the reliability of the connection between circuit boards and electronic components. The circuit board assembly includes a first circuit board, including a first side surface and a first sidewall pad, where the first sidewall pad is disposed on the first side surface, a second circuit board, fastened to the first circuit board, where the first sidewall pad is located at a position close to the second circuit board, and sidewall solder, adhered to the first sidewall pad and the second circuit board.

A circuit board includes at least one circuit board unit sequentially stacked in a thickness direction of the circuit board, an insulating layer, an electromagnetic shielding layer, and a barrier layer. The circuit board unit includes a substrate layer, and two conductive layers respectively disposed on two opposite sides of the substrate layer in a thickness direction of the substrate layer, and each of the conductive layers includes a plurality of signal lines. The insulating layer is located on a side of an outermost conductive layer away from the substrate layer. The electromagnetic shielding layer is located on a side of the insulating layer away from the substrate layer. The barrier layer is located between the electromagnetic shielding layer and the outermost conductive layer. The barrier layer at least covers a plurality of signal lines in the outermost conductive layer.

A component carrier assembly includes a first component carrier having a first electrically insulating layer structure and a via in the first electrically insulating layer structure, where the via is at least partially filled with electrically conductive material and where an upper part of the via extends beyond an outer main surface of the first component carrier; and a second component carrier having a second electrically insulating layer structure, and an electrically conductive adhesive material that is at least partially embedded in the second electrically insulating layer structure. The first component carrier and the second component carrier are interconnected and the upper part of the via at least partially penetrates into the electrically conductive adhesive material.

An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.

A sensor driving device includes a first substrate; a second substrate disposed on the first substrate; and an image sensor. The second substrate includes a body having first and second lateral surfaces; a first protrusion part protruding from the first lateral surface; and a second protrusion part protruding from the second lateral surface. The first protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The second protrusion part includes a first extension part, and a second extension part extending in a direction different from the first extension part. The first extension parts are disposed parallel to an optical axis of the image sensor. The second extension part of the first protrusion part is closer to the second extension part of the second protrusion part than to the first extension part of the second protrusion part.

A display assembly and a display apparatus. The display assembly comprises a display panel, a first flexible circuit board and a fingerprint sensor, wherein the first flexible circuit board is connected to the display panel in a binding manner and is positioned on the side of the display panel that faces away from a display surface; a display signal line coupled to the display panel is arranged on the first flexible circuit board; the fingerprint sensor is fixed on the side of the first flexible circuit board that is close to the display panel, and a light-sensitive surface of the fingerprint sensor is close to the display panel; and at least some sections of at least some fingerprint identification signal lines in fingerprint identification signal lines connected to the fingerprint sensor are arranged on the first flexible circuit board.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

An endoscope device and a cable assembly thereof are provided. The cable assembly includes a first substrate, a second substrate, and a wire. The first substrate includes a first body and a first solder pad disposed on the first body. The second substrate is correspondingly disposed on the first substrate and includes a second body, a second solder pad disposed on the second body and corresponding to the first solder pad, and an accommodating portion corresponding to the second solder pad. The wire includes a soldering portion disposed in the accommodating portion. The first solder pad and the second solder pad are coupled to each other by at least one of a first solder and a second solder, and the soldering portion and the second solder pad are coupled to each other by the first solder.