In an embodiment, a smart connector includes an Application Specific Electronics Packaging (ASEP) device formed by an ASEP manufacturing process, and a separate printed circuit board electrically connected to electrical components of the ASEP device. The ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

Provided is an electronic device that makes it possible to minimize decreases in mounting yield. In the electronic device, an OLED panel and an FPC are crimped and connected using an ACF. The FPC comprises a pattern that is symmetrical with respect to a line corresponding to a direction perpendicular to a straight line that connects electrodes connected to the OLED panel within the range in which the OLED panel is mounted.

A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.

IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination.

A circuit board has a flexible board with a principal surface, and a ground conductor provided in the flexible board. The flexible board is cut in at least one portion. The flexible board is bent using the cut portion, so that the flexible board has a first portion and a second portion at a different height from the first portion, and the ground conductor has a gap made by the cutting. At least one ground terminal is provided on the ground conductor near at least one end of the gap to electrically connect the circuit board to a ground provided in an external circuit.

A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.

A wiring board including: a frame base material; and a metal member, wherein the frame base material is formed in plate-shaped, and includes a through hole in a central region of the frame base material, the metal member includes a stage part and at least one bridge part, a width of the bridge part is equal to or narrower than a width of the stage part, the bridge part extending toward an outer side from the stage part, the stage part is arranged to be fit to the through hole, and the bridge part is arranged to be disposed facing the frame base material.