This application relates to a circuit board assembly. The circuit board assembly includes: a first circuit board. The first circuit board is connected to a connector; and a second circuit board. A first connecting portion is disposed on the second circuit board. The first connecting portion is electrically connected to the connector. The second circuit board includes a top surface and a side surface. The top surface intersects and is perpendicular to the side surface. The first connecting portion is disposed on the top surface, and extends towards the side surface. In this disclosure, the top surface intersects and is perpendicular to the side surface, to improve stability of connection between the connector and the first connecting portion, and improve working stability of the second circuit board, so as to improve working performance of the circuit board assembly and improve user experience.

An electronic device includes: a first printed circuit board (PCB) including a first plate and a first hole formed in the first plate, a second PCB including a second plate, an interposer including a third plate positioned between the first plate and the second plate, a plurality of first vias connecting the first plate and the third plate, a plurality of second vias connecting the second plate and the third plate, and a first reinforcement portion positioned in the first hole to bond the first plate and the third plate.

A stacking system is disclosed and includes a circuit board, an integrated circuit, a voltage regulation module and a heat dissipation module. The integrated circuit and the voltage regulation module are opposite disposed on a first side and a second side of the circuit board. The heat dissipation module includes a first heat dissipation component and a second heat dissipation component located at a top surface of the integrated circuit and the bottom surface of the voltage regulation module. The second heat dissipation component includes a base and an extended arm. The base is in thermal contact with bottom surface of the voltage regulation module. The extended arm is extended from the base to the first heat dissipation component and in thermal contact with the first heat dissipation component.

A condition monitoring device configured to be mounted on a machine for sensing, for example, vibrations produced by the machine during operation, includes a base, a printed circuit board assembly lying in a first plane, and first and second fasteners, each having a longitudinal axis, lying in a second plane perpendicular to the first plane, the first and second fasteners extending through the printed circuit board assembly and into the base. A third plane is perpendicular to the first and second planes and is located halfway between the longitudinal axes of the first and second fasteners. An integrated power supply is connected to the printed circuit board assembly, and at least two active sensing cells, such as vibration sensors, are arranged symmetrically relative to the second plane and/or symmetrically relative to the third plane.

The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.

A battery pack includes: a battery cell including first and second surfaces arranged at opposite sides and at which first and second electrodes are respectively located, and a side surface connecting the first and second surfaces to each other; a first circuit board arranged on the first surface and connected to the first electrode; a second circuit board arranged on the second surface; a first flexible line extending from a first side of the first circuit board to the second circuit board while surrounding a portion of the side surface of the battery cell; and a second flexible line extending from a second side of the first circuit board to the second surface of the battery cell while surrounding another portion of the side surface of the battery cell and connected to the second electrode.

An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.

Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by applying a downward force to the module PCB. A novel clip assembly is provided to apply the downward force, while also aligning the module PCB (and its LGA) to the motherboard or system board PCB. A heat shield is provided that is configured to be disposed over the module PCB to facilitate enhanced thermal spreading and lowering thermal resistance both towards the heat shield and the PCBs. Example modules include a WWAN module and an NVMe SSD module. The module PCB may employ an M.2 form factor or other form factors.

One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.