System for enabling circuit board surface-slot-edge connections. A main board includes a slot through its surfaces. At least one edge of the slot includes electrical contacts to the main board. An auxiliary board includes a connector component mounted on a surface that opposes a surface of the main board. When the connector component is aligned with the slot, the connector component can protrude vertically through the slot, in addition to moving laterally towards an edge of the slot. Electrical contacts on the edge of the slot can engage with electrical contacts in the connector component. This enables two boards to be arranged closely, without extending the main surface in an orthogonal or lateral direction, using a secure connection provided by a connector attached to the auxiliary board, rather than the main board.

A first hold-down includes a hold-down elastic piece supported like a cantilever beam by a reinforcing plate part. The hold-down elastic piece includes an elastic piece body extending from the reinforcing plate part, and a curve contact part formed at an end of the elastic piece body and projecting toward a CPU board beyond a CPU board opposed surface. A housing is formed in such a way that the curve contact part does not come into contact with the housing when the curve contact part no longer projects toward the CPU board beyond the CPU board opposed surface as a result of the curve contact part being elastically displaced toward an input-output board.

A connector assembly for connecting an upper circuit board to a lower circuit board is disclosed. The upper circuit board includes a series of fastener holes for a fastening device allowing attachment to the lower circuit board. The connector assembly has a support bracket with access holes aligned with the holes of the upper circuit board. The support bracket is configurable to be positioned over the upper circuit board. The connector assembly has a moveable cover bracket having a series of access holes. The cover bracket is suspended between the support bracket and the cover bracket. The cover bracket is moveable between an open position aligning the access holes with the access holes of the support bracket, and a closed position. In the closed position, the cover bracket blocks access between the access holes of the support bracket and the holes of the upper circuit board.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

An interposer array is provided, which includes an array substrate, a first interposer configured as a closed curve having a first space therein, a second interposer configured as a closed curve having a second space therein, a plurality of first bridges configured to connect the array substrate and the first interposer, and a plurality of second bridges configured to connect the first interposer and the second interposer.

An electronic device with high density for component arrangement includes a first substrate, a second substrate, a plural of passages formed through the first and the second substrates, a first contact arranged on the first face of the first substrate to conceal the corresponding one of the passages, a second contact arranged on the second substrate and adjacent to the corresponding one of the passages, and a conductor disposed in the passages. A first end of the conductor electrically connects the first contact, while a second end of the conductor electrically connects the second contact.

A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.

Disclosed is an antenna module including a first printed circuit board (PCB) including a first surface facing a first direction and a second surface facing a second direction opposite the first direction, a second PCB including a third surface facing the first direction spaced from the first PCB and a fourth surface facing the second direction spaced from the first surface, a radio frequency integrated circuit (RFIC) disposed on the first surface, and a connection member comprising a conductive material connecting the first surface to the fourth surface. The at least one first conductive pattern is connected to the RFIC. The at least one third conductive pattern is connected to the RFIC via the connection member. The at least one first conductive pattern and the at least one third conductive pattern at least partially overlap with each other at least partly, when viewed from above the second surface.