The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.

A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

A dual printed circuit board assembly for vehicle lights, the dual printed circuit board including a dual printed circuit board and a dual connector. The dual printed circuit board having a first substrate with a first layout, a second substrate opposite to the first substrate with a second layout, and a common panel that supports the first substrate on a first side and the second substrate on a second side, wherein the first layout is populable by a first plurality of light sources to be used in a first light of the vehicle lights and the second layout is populable by a second plurality of light sources to be used in a second light of the vehicle lights. The dual connector having a first jumper connector electrically connected to the first layout, and a second jumper connector opposite to the first jumper connector and electrically connected to the second layout.

Disclosed is an apparatus and method for wirelessly transmitting power to power receivers from a power transmitter. The present disclosure provides a rational search procedure for locations of the power receivers, and provides a function of simultaneously charging multiple receivers using microwave multi-focusing. The wireless power transmission method performed by a power transmitter includes determining angular coordinates of the power transmitter in relation to a position of at least one power receiver; determining a distance between the at least one power receiver and the power transmitter based on the determined angular coordinates by using a focused microwave field; determining a location of the at least one power receiver based on the determined angular coordinates and the distance; and wirelessly transmitting power by focusing the microwave field to the determined location of the at least one power receiver.

In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

A circuit assembly includes an insulated metal substrate (IMS), a switching device located on the IMS, and a printed circuit board (PCB) directly attached and electrically connected to the IMS with no gap or substantially no gap therebetween and including a cutout that receives the switching device.