An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Right angle male connectors re arranged on each of the first boards and right angle female connectors are arranged on each of the second boards. The right angle male connectors and the right angle female connectors directly cooperate and are connected in one-to-one correspondence.

An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.

A backplane and a communications device are disclosed. In one example, the backplane includes at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by the flexible cables. Each of the connectors is provided with a housing, and multiple signal pins are installed on the housing. The housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device. One end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable.

Provided is a power conversion device which comprises a main circuit board, a first board, and a second board and which has a reduced size. The main circuit board has a rectifier circuit and an inverter circuit which are disposed in a high-power section, the rectifier circuit rectifying AC voltage and The second board is provided with a The first board is connected to the main circuit board and to the second board, and is provided with: a first circuit disposed in a low-power section. The second board is provided with a second circuit disposed in a low-power section. section from each other in a reinforced manner; an insulating transformer disposed in the reinforced insulation region and constituting a constituent component of a power supply circuit for receiving the DC voltage and supplying power to the first circuit and to the second circuit; and an insulating element disposed in the reinforced insulation region and allowing a signal to be exchanged between the first circuit and the second circuit.

A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.

Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

A backplane and a communications device are disclosed. The backplane includes: at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by means of the flexible cables, each of the connectors is provided with a housing and multiple signal pins installed on the housing, and the housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device; one end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable. When the communications device provided with the backplane transmits a high-rate signal, transmission quality and a transmission rate are relatively high.

This invention describes an improved backplane connector operating at speeds over 25 Gbps including a single-piece configuration that eliminates the insertion point present in 2-gender connectors. As a result, the signal path matches more closely the same path geometry that is found on the daughterboard and on the backplane permitting superior signal integrity and lower losses through the signal transmission line from source to destination. The single-piece backplane connector comprises a protective cover slidably attached over a staggered body assembly. The protective cover comprises a plurality of contact orifices to permit the path through of a corresponding plurality of pin contacts located in a front portion of the staggered body assembly, and at least two guide orifices to permit the path through of at least two corresponding guide pins located in the front portion of the staggered body assembly. The staggered body assembly comprises a plurality of alternating PCB layers and dielectric spacers, wherein the PCB layers include a plurality of traces, wherein each trace electrically connects each of the pin contacts on the front end with a corresponding pin contact on the bottom mating with the corresponding plurality of plated through holes in the daughterboard PCB. Finally, the protective cover further comprises a return spring mechanism to slide from an unpressed position to a pressed position, and the protective cover slides towards the staggered body assembly to permit the pin contacts to protrude through the orifices and to mate with the corresponding plurality of plated through holes in the backplane PCB.

A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Printed circuit includes a planar substrate having opposite sides and a thickness extending therebetween. The sides extend parallel to a lateral plane. The printed circuit also includes a plurality of conductive vias extending through the planar substrate in a direction that is perpendicular to the lateral plane. The conductive vias include ground vias and signal vias. The signal vias form a plurality of quad groups in which each quad group includes a two-by-two array of the signal vias. Optionally, the printed circuit also includes signal traces that electrically couple to the signal vias. The signal traces may form a plurality of quad lines in which each quad line includes four of the signal traces. The four signal traces of each quad line may extend parallel to one another and be in a two-by-two formation.