Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A system for incorporating electronic functionality into a flexible layer includes a flexible printed circuit board having a spine portion and one or more legs in electronic communication with the spine portion. Multiple pads may be disposed on the flexible printed circuit board. The spine portion and the one or more legs may be structured and arranged to be disposed within one or more pockets of the flexible layer. The system may further include electronic devices, each one of which may be in electronic communication with at least one of the pads. In addition, the system may include a controller in electronic communication with at least one of the pads. The system may be characterized by an absence of any external hard-wire interfaces for communication external to the system.

A wiring substrate is connected to a backplane, and includes: a first connector that is mounted on one surface of the wiring substrate and is connected to the backplane; an opening portion that is formed in the one surface on a side opposite to a side connected to the backplane of the first connector, and through which a cable having one end connected to the first connector is passed; an integrated circuit that is mounted on the one surface on a side opposite to a side on which the first connector is present relative to the opening portion; and a second connector that is mounted on the other surface on a side opposite to the one surface in the vicinity of the integrated circuit on the side opposite to the side on which the first connector is present relative to the opening portion, is connected to the integrated circuit via a through hole penetrating the wiring substrate, and is connected to the other end of the cable.

The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.

A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.

An electrical connector includes a connector housing having a mating end at a front of the connector housing configured to be mating with a mating electrical connector. The connector housing includes a contact module chamber. An electrical connector includes a stack of contact modules received in the contact module chamber. Each contact module includes a module body holding a plurality of contacts. The contacts have mating ends at the mating end of the connector housing for mating with the mating electrical connector; and an electrical connector includes a contact module biasing members between the contact modules and the connector housing to forward bias the contact modules in the contact module chamber, wherein the contact module biasing members are compressible to allow the contact modules to move independent from each other relative to the connector housing in the contact module chamber when mating with the mating electrical connector.

An electrical connector includes a housing holding wafer assemblies in a wafer stack each including a wafer body holding a leadframe with signal contacts arranged in pairs and extending between mating ends and mounting ends. Each pair includes a primary signal contact and a secondary signal contact. Each signal contact has a main body extending through the wafer bodies and a mating end extend from the wafer body presented at the mating interface. The mating ends are twisted 45° relative to the main bodies. The mating end of the primary signal contact is arranged at a first side of the main body and the mating end of the secondary signal contact is arranged at a second side of the main body to define a twisted pair interface configured to be mated with the mating signal contacts of the mating electrical connector.

An electrical connector includes a connector housing having a mating end at a front of the connector housing configured to be mating with a mating electrical connector. The connector housing includes a contact module chamber. An electrical connector includes a stack of contact modules received in the contact module chamber. Each contact module includes a module body holding a plurality of contacts. The contacts have mating ends at the mating end of the connector housing for mating with the mating electrical connector; and an electrical connector includes a contact module biasing members between the contact modules and the connector housing to forward bias the contact modules in the contact module chamber, wherein the contact module biasing members are compressible to allow the contact modules to move independent from each other relative to the connector housing in the contact module chamber when mating with the mating electrical connector.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

The present disclosure provides a dual-backplane structure and electronic device using the same. The dual-backplane structure includes: a first backplane having an opening, and the front side of the first backplane includes at least one connector connected with a connector of the second assembly surface on a main board of a control module; a second backplane disposed on the back of the first backplane, the front side of the second backplane includes a connector connected with a connector of the first assembly surface on a main board of a control module; the back side of the second backplane includes a plurality of hard disk connectors for connecting with the hard disk module. At least one connector on the front side of the second backplane is connected with the connector corresponding to the first assembly surface on the main board through the opening of the first backplane.