An electrical connector includes: an insulating housing; and plural terminals held in the insulating housing and arranged in terminal pairs, each of the terminals including: a holding portion held in the insulating housing; a cantilever extending forward from the holding portion, a slot being provided on the cantilever; a contact portion at a front of the cantilever; and a mounting portion for mounting on a circuit board; wherein the slot extends to the contact portion; and in each terminal pair, a first distance from a center of the contact portion of one terminal thereof to a center of the contact portion of the other terminal thereof is less than a second distance from a center of the mounting portion of one terminal thereof to a center of the mounting portion of the other terminal thereof.

The disclosure provides a layout method for backplane connector, a backplane, and an electronic terminal. The backplane includes: a circuit board; and a first connector unit. The first connector unit includes at least one group of first connector modules, each group of the first connector modules comprises a front connector and a back connector; pins in odd-numbered columns of the front connector have the same arrangement as pins in odd-numbered columns of the back connector, pins in even-numbered columns of the front connector have the same arrangement as pins in even-numbered columns of the back connector; the front connector is mounted on the front of the circuit board, the back connector is on the back of the circuit board, and the back connector is staggered one column of pins relative to the front of the front connector.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A connector with contact tails configured to provide a connector footprint enabling a low cost printed circuit board. The contact tails are positioned to leave routing channels, parallel to an edge of a printed circuit board, within the connector footprint. The routing channels may enable routing of high speed signal traces out of the connector footprint on a small number of routing layers. In a connector with 16 columns, each with 8 pairs of signal traces, two routing layers may be adequate to route traces connecting all of the signal vias in the connector footprint to components at the interior of the printed circuit board.

A mid-plane assembly includes a main circuit board portion including a plurality of electrical connectors configured to releasably engage a plurality of devices, a first circuit board portion, and a first electrical coupling assembly configured to electrically couple the first circuit board portion to the main circuit board portion and position the first circuit board portion essentially orthogonal to the main circuit board portion.

A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

A motherboard module is adapted for an M.2 expansion card to configure. The M.2 expansion card includes a connecting end and a fixing end. An edge of the fixing end has a semi-circular hole. The motherboard module includes a motherboard body, a locking member, and an abutting member. The motherboard body includes an expansion card slot, a first fixing hole, and a second fixing hole. The locking member is detachably fixed in the first fixing hole. The abutting member has a first end and a second end. The first end is detachably fixed in the second fixing hole. When the M.2 expansion card is installed on the motherboard module, the abutting member is located between the M.2 expansion card and the motherboard body, and the second end abuts against the M.2 expansion card. An electronic device is further provided.

An electronic device with parallel backplanes and a storage device with parallel backplanes. The electronic device includes a front inserting assembly, a rear inserting assembly, and a backplane assembly. The backplane assembly is connected to the front inserting assembly and the rear inserting assembly. The backplane assembly includes a plurality of backplanes arranged in parallel at intervals, the front inserting assembly includes a plurality of first units whose arrangement direction is the same as an arrangement direction of the backplanes, and the rear inserting assembly includes a plurality of second units whose arrangement direction intersects the arrangement direction of the backplanes. The backplane assembly is provided with the structure including the plurality of backplanes arranged in parallel at intervals and the channel between adjacent backplanes. In addition, the first units and the second units are connected to two opposite sides of the backplanes, respectively.