An illumination dummy module is adapted for covering and protecting a card slot and includes a circuit board, a power pin, a clock pin, a data pin, at least one light source, a power converter, and a drive circuit. The circuit board includes an insertion part for inserting into the card slot. The power pin, the clock pin and the data pin are disposed to the insertion part, and the light source is disposed on the circuit board. The power converter receives input power from the card slot via the power pin, and converts the input power into output power. The drive circuit is disposed on the circuit board, and receives the output power from the power converter. The drive circuit also respectively receives a clock signal and a control command via the clock pin and the data pin, to enable or disable the light source.

An interconnection system is described including a first printed circuit board, the first printed circuit board including a first portion of a filter, the filter used to communicate a signal between the first printed circuit board and a second printed circuit board, and a mechanical structure for coupling the signal between the first printed circuit board and the second printed circuit board, the second printed circuit board being oriented at an angle with respect to the first printed circuit board.

A backplane and a communications device are disclosed. In one example, the backplane includes at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by the flexible cables. Each of the connectors is provided with a housing, and multiple signal pins are installed on the housing. The housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device. One end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable.

Methods and apparatus for a host to communicate with memory modules via an interposer are presented. An apparatus includes the interposer and a plurality of memory module sockets attached to the interposer. The interposer includes at least one trace electrically connecting a first one of the plurality of memory module sockets and a second one of the plurality of memory module sockets. The at least one trace includes a branching point. A first length of the at least one trace between the branching point and the first one of the plurality of memory module sockets substantially equals to a second length of the at least one trace between the branching point and the second one of the plurality of memory module sockets. The first one of the plurality of memory module sockets communicates with a host via the branching point, a connector, and a circuit board.

Provided is an electronic device that is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device includes a storage substrate, and a plurality of flash storage units which are mounted on the storage substrate. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction, or in both the width and the length directions of the flash storage unit. The storage substrates are arranged on at least one surface of the base board. The backplane includes a plurality of connectors for electric connection of the respective storage substrates, and is mounted orthogonally onto the one surface of the base board. The flash storage unit may be an M.2 SSD or an mSATA SSD.

Various systems may benefit from suitable arrangements and configurations of modules. For example, certain electronics systems may benefit from systems and methods for stacking electronic modules on a base board. A system of stacking computer modules can include a base board, which can be a printed circuit board (PCB). The system can also include a first plurality of connectors, mounted to and in electrical communication with the base board. The system can further include a first module, the first module including a second PCB and a second plurality of bottom connectors configured to engage the first plurality of connectors and a third plurality of top connectors. The system can additionally include a second module, the second module including a third PCB and a fourth plurality of bottom connectors configured to engage the third plurality of top connectors of the first module.

A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

A USB socket connector includes a columnar housing, a circuit board, and an expansion board. The columnar housing has a front portion and an opposite rear portion. The columnar housing includes an accommodating slot recessed from the front portion toward the rear portion and a receiving slot recessed on the rear portion and in air communication with the accommodating slot. A cross section of the receiving slot is larger than that of the accommodating slot. The circuit board includes a tongue plate portion arranged on one side thereof and having a USB3.1 Type-C interface. The circuit board is inserted into the accommodating slot, and the tongue plate portion is arranged in the front portion. The expansion board is substantially and perpendicularly connected to an end of the circuit board away from the tongue plate portion, and the expansion board is arranged in the receiving slot.

A socket connector includes a socket substrate having first socket substrate conductors and second socket substrate conductors, receptacle contacts electrically coupled to corresponding first socket substrate conductors and socket contacts electrically coupled to corresponding second socket substrate conductors. The receptacle contacts have receptacles receiving pin contacts of an electronic package and the socket contacts have terminating ends and mating ends with deflectable spring beams terminated to package contacts of the electronic package. At least one of the first socket substrate conductors and the second socket substrate conductors are configured to electrically connect the electronic package with the host circuit board.