An electronic device includes a motherboard, a bridging device, and an add-in card. The motherboard includes a processor, a first circuit board, and a first connector. The processor is coupled to the first connector through the first circuit board. The bridging device includes a second circuit board and a second connector and is disposed on the motherboard and coupled to the first connector. The second connector is coupled to the first connector through the second circuit board. The add-in card includes a third circuit board and a peripheral circuit and is disposed on the bridging device and coupled to the second connector. The peripheral circuit is coupled to the second connector through the third circuit board. The processor is coupled to the peripheral circuit through a signal path including the first circuit board, the first connector, the second circuit board, the second connector, and the third circuit board.

A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.

An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

A housing has a first positioning hole that penetrates the housing in the vertical direction. A suction cap includes a suction plate part to be sucked by a suction nozzle, and a plurality of positioning protrusion parts, each of which is to be inserted into a first positioning hole of the housing of an input/output board-side connector and a CPU board-side connector in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector. Each positioning protrusion part is inserted into each corresponding first positioning hole in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector, which achieves the positioning of the input/output board-side connector and the CPU board-side connector with respect to the suction cap.

Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

A display device includes a display panel, a main circuit board, a first connecting circuit board, a second connecting circuit board, and a sealing member. The display panel includes a first pad row and a second pad row. The first connecting circuit board is connected to the first pad row, and the second connecting circuit board is connected to the second pad row. The second pad row is spaced farther from an edge of the display panel than the first pad row. The sealing member is disposed between the first connecting circuit board and the second connecting circuit board to seal a gap between the first connecting circuit board and the display panel.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

A semiconductor package structure and manufacturing method thereof are provided. The semiconductor package structure includes a package structure and a rigid-flexible substrate. The package structure includes semiconductor dies, a molding compound and a redistribution layer. The molding compound laterally encapsulates the semiconductor dies. The redistribution layer is disposed at a front side of the semiconductor dies and electrically connected to the semiconductor dies. The rigid-flexible substrate is disposed at a side of the redistribution layer opposite to the semiconductor dies, and includes rigid structures, a flexible core and a circuit layer. The rigid structures respectively have an interconnection structure therein. The interconnection structures are electrically connected to the redistribution layer. The flexible core laterally penetrates and connects the rigid structures. The circuit layer is disposed over a surface of the flexible core, and electrically connected with the interconnection structures.

Aspects of the disclosure provide a package system that includes a first integrated circuit (IC) package and a second IC package. The first IC package includes a first IC chip mounted on a first substrate-chip surface of a first package substrate. The first package substrate includes first near-conductive layers that are closer to the first substrate-chip surface than first far-conductive layers. The second IC package includes a second IC chip mounted on a second substrate-chip surface of a second package substrate. The second package substrate includes second near-conductive layers that are closer to the second substrate-chip surface than second far-conductive layers. A first contact structure on the first substrate-chip surface and a second contact structure on the second substrate-chip surface electrically couple the first IC chip with the second IC chip through electrical connections in the first and second near-conductive layers.