H05K2201/046

Imaging unit and endoscope
10925464 · 2021-02-23 · ·

An imaging unit includes: an imaging element including a light receiver and a connection terminal formed on a back surface of the imaging element; a flexible printed circuit board including a connection electrode forming region, a cable connection electrode forming region, and a bent portion provided between the connection electrode forming region and the cable connection electrode forming region; and sealing resin filled around a junction between the imaging element and the flexible printed circuit board. The bent portion includes: a first bent portion that is bent toward the imaging element from the connection electrode forming region located parallelly to the light receiver of the imaging element; and a second bent portion that is provided continuously with the first bent portion and lets the cable connection electrode forming region extend in a direction opposite to a direction toward the imaging element.

Bending fixture and support components for a semi-flexible printed circuit board assembly

A computing system is provided. The computing system includes a semi-flexible printed circuit board assembly (PCBA) with a first element and a second element. The first element is configured to move in a non-planar direction with respect to the second element. The computing system also includes an internal trace connecting the first element and the second element of the semi-flexible PCBA. The computing system also includes a support mechanism, which is configured to constrain relative movements between the first element with respect to the second element of the semi-flexible PCBA.

Apparatus for combining printed circuit boards

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

Circuit board structure and display panel

The present disclosure provides a circuit board structure and a display panel, the circuit board structure includes mounting substrates and a flexible conductive substrate, and the flexible conductive substrate is connected between two adjacent mounting substrates to connect the two mounting substrates together.

FLEXIBLE PRINTED CIRCUIT BOARD AND MOBILE TERMINAL COMPRISING SAME

A mobile terminal includes a case; a circuit board disposed inside the case; a flexible printed circuit board electrically connected to the circuit board, and having insulating layers and conductive layers stacked in an alternating manner; a first antenna disposed on a first region of the flexible printed circuit board and facing an end surface of the case and configured to transmit radio signals in a direction toward the end surface of the case; a plurality of microstrip lines disposed on a bent second region of the flexible printed circuit board at a side portion of the first region; and a copper clad laminate stacked second antenna disposed on a third region of the flexible printed circuit board positioned on another side portion of the second region and configured to transmit radio signals in a direction toward a side surface of the case.

THROUGH-BOARD DECOUPLING CAPACITANCE ARRANGEMENTS FOR INTEGRATED CIRCUIT DEVICES

Decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, where the first circuit board is coupled to first surface of a system circuit board. The assembly includes a second circuit assembly comprising a second circuit board having decoupling capacitance for the integrated circuit device, where the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

BENDING FIXTURE AND SUPPORT COMPONENTS FOR A SEMI-FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY
20200404779 · 2020-12-24 ·

A computing system is provided. The computing system includes a semi-flexible printed circuit board assembly (PCBA) with a first element and a second element. The first element is configured to move in a non-planar direction with respect to the second element. The computing system also includes an internal trace connecting the first element and the second element of the semi-flexible PCBA. The computing system also includes a support mechanism, which is configured to constrain relative movements between the first element with respect to the second element of the semi-flexible PCBA.

Foldable board with flexible PCB coupling
10856409 · 2020-12-01 · ·

A junction between two circuit board segments can be made using a flexible printed circuit board (PCB), permitting the two circuit board segments to be movably positioned with respect to one another, while maintaining electrical connections between the board segments through the junction. Such a design with flexible PCB junctions can allow a single, foldable board with multiple board segments to be used in place of a set of multiple circuit boards that must couple together using connectors and cables.

Optoelectronic assembly, and method for producing an optoelectronic assembly
10834809 · 2020-11-10 · ·

An optoelectronic assembly is provided in different embodiments. The optoelectronic assembly has the following; a printed circuit board; at least one optoelectronic first component which is arranged on a first face of the printed circuit board; a heat sink which has a first surface that is arranged on a second printed circuit board face facing away from the first component, wherein a boundary surface extends between the second face and the first surface; and at least one first welding connection, by means of which the heat sink is directly connected to the printed circuit board in a bonded manner and which together with the boundary surface forms a first cut surface, the first component at least partly overlapping the cut surface.

Interconnectable circuit boards adapted for lateral in-plane bending
10811799 · 2020-10-20 · ·

Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.