Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.

A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.

Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.

Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.

A semi-finished product of an electric heater device has a casing body (2) defining a housing for at least one electric heater. The casing body (2) has a first or predefined configuration, in particular a substantially planar, or plate-like, or two-dimensional configuration, and is prearranged for being folded in substantially predetermined areas (1a), which define in the casing body (2) a plurality of regions (4, 5, 6) that are at least in part relatively stiff and are suitable to be folded with respect to one another in one said folding area (1a). In this way, a second or different configuration, in particular a substantially three-dimensional configuration, can be bestowed upon the casing body (2).

A system for controlling a robotic end-effector is disclosed. The system includes a robotic arm, a surgical tool including an end-effector with articulatable arm and a clamp jaw. A tool driver is coupled to the surgical tool and a motor is coupled to the tool driver and is configured to drive the surgical tool. A sensor is configured to sense external forces applied to the end-effector. A central control circuit is configured to control the tool driver. The central control circuit is configured to receive a sensed parameter from the sensor, receive a sensed motor current (I) from the motor, and control the tool driver based on the sensed parameter and the motor current (I).

The invention relates to a thermal-type flow sensor (1) for a flow meter, comprising a main channel part (3b) with a main channel (3) for a medium whose flow is to be determined, a sensor tube (4), having a first tube portion (5), a second, opposite tube portion (8), a sensing portion (11) connecting the first and second tube portions, at least two sensing or heating elements (12) for measuring a temperature differential or a power differential in the sensor tube, a thermally conductive frame element (13) in contact with at least the first tube portion, the second tube portion as well as the main channel part, configured to equalize temperature gradients, wherein thermally conductive frame element (13) is a printed circuit board (PCB) (14).

The invention relates to an ion transport device which is designed to transport ions by means of an electric field. The ion transport device has an ion transport channel in which an ion transport chamber is formed. In order to generate the electric field, the ion transport device has a plurality of field generating electrodes which are arranged one behind the other along the length of the ion transport channel in order to move ions through the ion transport chamber in a transport direction. The invention additionally relates to an ion mobility spectrometer and to a mass spectrometer.

A system for controlling a robotic arm is disclosed. The system includes a robotic arm including a surgical tool, a tool driver, and at least two sensors disposed on the robotic arm to redundantly monitor a status of the robotic arm and to verify an operational parameter of the surgical robotic tool. A central control circuit is configured to measure a first physical property of the robotic arm based on readings from the first sensor, measure a second physical property of the robotic arm based on readings from the second sensor, and determine a status of the robotic arm based on the first and second measurements of the first and second physical properties of the robotic arm.