A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.

According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.

A flexible circuit (FC) comprises a primary dielectric layer having a plurality of substantially parallel conductive circuit traces disposed therein and a secondary dielectric layer extending from or attached to the primary dielectric layer, wherein the secondary dielectric layer does not have any conductive circuit traces disposed therein, and wherein at least one of the primary and secondary dielectric layers defines an alignment feature for wrapping and securing the FC about a central structure. A method of wrapping and securing the FC about a central stricture comprises wrapping the FC about the central structure while aligning each alignment feature with a respective complimentary alignment feature such that the FC fully encompasses the central structure and is secured thereabout.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

A substrate for a tamper sensor includes a plurality of walls and a tab. The walls define a protective volume with an open side. The walls have a plurality of open edges adjacent the open side and a plurality of interior edges different from the open edges. The tab extends from one of the interior edges of one of the walls and is disposed within the protective volume.

Provided are a control device for unmanned aerial vehicle and an unmanned aerial vehicle. The control device for unmanned aerial vehicle includes a shell, an inertial measurement device fixed in the shell, a main flight control circuit board electrically connected to the inertial measurement device, and a flexible interface board electrically connected to the main flight control circuit board and appressed against the inwall of the shell. At least one external device is connected to two opposite sides of the flexible interface board through the shell.

An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a grounding shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The grounding shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stack such that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.

Provided are a control device for unmanned aerial vehicle and an unmanned aerial vehicle. The control device for unmanned aerial vehicle includes a shell, an inertial measurement device fixed in the shell, a main flight control circuit board electrically connected to the inertial measurement device, and a flexible interface board electrically connected to the main flight control circuit board and appressed against the inwall of the shell. At least one external device is connected to two opposite sides of the flexible interface board through the shell.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

An object of the present invention is to improve the reliability of a power converter against electromagnetic noise. A power converter according to the present invention includes: a power semiconductor circuit unit; a DCDC converter circuit unit; a first drive circuit board that outputs a drive signal to the power semiconductor circuit unit; a second drive circuit board that outputs a drive signal to the DCDC converter circuit unit; and a control circuit board that outputs a first control signal for controlling the first drive circuit board and a second control signal for controlling the second drive circuit board, in which the control circuit board is arranged at a position facing the second drive circuit board with the power semiconductor circuit unit and the DCDC converter circuit unit interposed therebetween, the first drive circuit board is arranged to be substantially parallel to an array direction of the control circuit board and the second drive circuit board, and the first drive circuit board has a relay wiring that relays the second control signal output from the control circuit board to the second drive circuit board.