Disclosed are a body of an unmanned aerial vehicle and an unmanned aerial vehicle including the same. The body includes a housing arranged in a first direction and including at least four housing sidewalls and an opening defined by the housing sidewalls and configured to receive a battery pack, a propeller support extending a specific distance from each housing sidewall in a second direction away from the center of the housing and perpendicular to the first direction and having, on a distal end, a motor and a propeller connected to the motor, and a PCB disposed on at least one of the housing sidewalls and associated with operating the motor and the propeller.

A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.

A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

Examples may include techniques for use of a latch to secure a device inserted in a host computing system. The latch including a housing having holes or ports and an active contacts pad to receive external communication or control links routed through the holes or ports and to further route the communication or control links to circuitry at the device. The latch also including a securing pin attached to a lever to secure the device to the host computing system when the lever is engaged.

An electromagnetic tracking system includes a magnetic transmitter configured to output magnetic fields, a receiver responsive to the magnetic fields, an electronics assembly having conductive elements that cause distortion to the magnetic fields, and an output mechanism configured to output a position of the receiver relative to the magnetic transmitter, wherein the magnetic transmitter has at least one winding disposed around a hollow ferromagnetic core comprised of conductive material through which current is made to flow by the electronics, wherein the electronics assembly is at least partially contained within the hollow portion of the hollow ferromagnetic core. Methods of manufacturing include shaping walls into a hollow shell to surround an electronics assembly, covering the hollow shell with ferromagnetic material, inserting the wrapped hollow shell into a plastic bobbin, and winding the plastic bobbin with coil wire to produce three orthogonal windings

In embodiments, a device may include a single electromagnetic interference (EMI) shield plate that defines an enclosed area. The EMI shield plate may have an inner surface and an outer surface opposite the inner surface. The device may further include a first printed circuit board (PCB) coupled with the inner surface, wherein the first PCB is within the enclosed area. Other embodiments may be described and/or claimed.

A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Example embodiment is a power converter that adopt a 3D structure to increase the power density and improve thermal performance. The power converter includes a bottom substrate and at least one side substrate. Both the bottom substrate and the side substrate are rigid. Each side substrate is connected with the bottom substrate by a flexible substrate and forms an angle with the bottom substrate. The bottom substrate is further electrically connected with a plurality of surface mounting devices which are rigid. The flexible substrate provides electrical connection between the bottom substrate and the side substrate.

An adapter board structure for a power module of a DC power supply is disclosed. The DC power supply includes a casing. A main circuit control board and at least one power module are disposed in the casing. One side of the power module is provided with a secondary circuit control board. The secondary circuit control board has an input port and an output port for connection of a control wire. Another side of the power module is provided with an adapter board. The adapter board also has an input port and an output port for connection of the control wire. The power module can be electrically connected through the adapter board, and the adapter board has the functions of shielding and wind guiding, thereby isolating noise and electromagnetic interference and improving heat dissipation.