An apparatus has a mother board with external connectors on a first side and flash memory connectors on a second side. Flash memory cards are connected to the flash memory connectors. Each flash memory card has flash memory and a flash memory controller. A thermal dissipation assembly is provided for each flash memory card. The thermal dissipation assembly includes a heat plate with a first end adjacent to the flash memory controller and a second end adjacent to the flash memory. A heat sink is attached to the flash memory cards at the second end. A polymer surrounds the external connectors and fully encloses remaining portions of the first side of the mother board, and fully encloses the flash memory cards, the thermal dissipation assembly and the heat sink.

A circuitized structure with a 3-dimensional configuration. A base structure is provided that includes an insulating substrate of electrically insulating material with a flat configuration, and further includes an electric circuit including at least one layer of electrically conductive material arranged on the insulating substrate. The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching a gel point. The base structure is formed according to the 3-dimensional configuration, and the cure of the thermosetting material is completed.

An object of the present invention is to improve the reliability of a power converter against electromagnetic noise.

A power converter according to the present invention includes: a power semiconductor circuit unit; a DCDC converter circuit unit; a first drive circuit board that outputs a drive signal to the power semiconductor circuit unit; a second drive circuit board that outputs a drive signal to the DCDC converter circuit unit; and a control circuit board that outputs a first control signal for controlling the first drive circuit board and a second control signal for controlling the second drive circuit board, in which the control circuit board is arranged at a position facing the second drive circuit board with the power semiconductor circuit unit and the DCDC converter circuit unit interposed therebetween, the first drive circuit board is arranged to be substantially parallel to an array direction of the control circuit board and the second drive circuit board, and the first drive circuit board has a relay wiring that relays the second control signal output from the control circuit board to the second drive circuit board.

A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

An electronic component module comprises: a first printed circuit board; a transformer which is disposed on the first printed circuit board and includes a core and a first coil disposed within the core; a second printed circuit board which is disposed on the transformer; a busbar which is disposed outside the core and to which the opposite ends of the first coil are coupled; and a bracket which is disposed outside the busbar and coupled to the core.

Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

A bi-directional optical sub assembly connecting structure which is disclosed includes a first connecting plate, a second connecting plate, a connector, a first circuit, and a second circuit. The first connecting plate includes a plurality of first contacts for electrically connecting to a first transmitting end. The second connecting plate connects with the first connecting plate and includes a plurality of second contacts for electrically connecting to a second transmitting end. The connector connects with the first connecting plate for electrically connecting to a printed circuit board. The first circuit is located on the first connecting plate and electrically connected to the plurality of first contacts and the connector. The second circuit is located on the first connecting plate and the second connecting plate and electrically connected to the plurality of second contacts and the connector.

An electronic component module comprises: a first printed circuit board; an inductor disposed on the first printed circuit board and comprising a core, and a first coil disposed in the core; a metal plate disposed on the inductor, and a busbar disposed on the lower portion of the inductor and coupled to the first printed circuit board, wherein the first coil comprises a first terminal protruding upward from the core, and a second terminal protruding downward from the core, and the first terminal is coupled to the metal plate, and the second terminal is coupled to the busbar.

An electronic module includes a first circuit board. The first circuit board has electronic components, spacers, a cover plate, and a casting compound. The spacers are positioned so as to rest at least in corner regions of the first circuit board. The cover plate is positioned on the spacers. The casting compound acts as an end face and seals a gap formed by the spacers between the first circuit board and the cover plate, so as to form a housing for the electronic components, which are positioned therein. The casting compound secures the cover plate to the first circuit board via positive engagement. A coefficient of linear thermal expansion of the casting compound corresponds substantially to a coefficient of linear thermal expansion of the circuit board and of the cover plate.