An arrangement is provided reduces deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.

A circuitized structure with a 3-dimensional configuration. A base structure is provided that includes an insulating substrate of electrically insulating material with a flat configuration, and further includes an electric circuit including at least one layer of electrically conductive material arranged on the insulating substrate. The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching a gel point. The base structure is formed according to the 3-dimensional configuration, and the cure of the thermosetting material is completed.

An electric connector comprises a contact, a base assembly, a pair of first circuit board sections, and a plurality of electric components. The base assembly has a connector face on a first side and an interior side opposite to the connector face. The contact is disposed on the connector face. The pair of first circuit board sections are disposed on the interior side and extend away from the base assembly. The pair of first circuit board sections face each other. At least one electric component is disposed on each of the first circuit board sections.

An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

A heat dissipating structure generally utilized in a telecommunication product includes a plurality of PCB modules, a metal framework, a top lid, and a perforated panel. The heat dissipating structure is generally utilized in a telecommunication product. The plurality of PCB modules are coupled in series and configured to form a chassis. The metal framework is housed within the chassis and forms an internal chamber. The top lid is disposed at a top side of the heat dissipating structure. The perforated panel is disposed below the top lid and over the internal chamber. The perforated panel includes a plurality of ventilation holes. The internal chamber cooperates with the plurality of ventilation holes to dissipate heat.

Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

An electronic device includes: a host box comprising a host processor configured to control an operation of the electronic device, a host motherboard in which the host processor is disposed, and a host power supply unit (PSU) configured to supply power to a component connected to the host motherboard; and one or more extension boxes controlled by the host box, wherein each of the one or more extension boxes comprises an extension motherboard independent of the host box, and an extension PSU independent of the host box and configured to supply power to a component connected to the extension motherboard.

Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.

A semiconductor module includes a metal substrate having a mounting surface, a first conductive plate on the mounting surface, an insulating substrate on the first conductive plate, a second conductive plate on the insulating substrate, a conductive pad on the insulating substrate, a semiconductor element on the second conductive plate, a circuit board electrically connected to the conductive pad, a resin case connected to the metal substrate and extending along at least a portion thereof, and around the first conductive plate, the insulating substrate, the second conductive plate, the conductive pad, the semiconductor element, and the circuit board, and a silicone gel in a region bounded by the metal substrate and the resin case. The circuit board comprises a plurality of planar surfaces oriented perpendicular to the mounting surface of the metal substrate.