Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

A wiring substrate is connected to a backplane, and includes: a first connector that is mounted on one surface of the wiring substrate and is connected to the backplane; an opening portion that is formed in the one surface on a side opposite to a side connected to the backplane of the first connector, and through which a cable having one end connected to the first connector is passed; an integrated circuit that is mounted on the one surface on a side opposite to a side on which the first connector is present relative to the opening portion; and a second connector that is mounted on the other surface on a side opposite to the one surface in the vicinity of the integrated circuit on the side opposite to the side on which the first connector is present relative to the opening portion, is connected to the integrated circuit via a through hole penetrating the wiring substrate, and is connected to the other end of the cable.

A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.

The application relates to a galvanic separating apparatus, including a printed circuit board, the printed circuit board including a first soldering pad, a second soldering pad and a recess, whereby the pads are arranged on a lower side of the printed circuit board thereby defining a clearance and/or creepage distance between the pads, and the recess is arranged between the pads, a primary insulated winding layer connected to the first soldering pad and a second insulated winding layer connected to the second soldering part, whereby the winding layers are arranged on an upper side of the printed circuit board, and an insulating layer, whereby the insulating layer extends from the upper side through the recess and protrudes on the lower side beyond the printed circuit board thereby increasing the clearance and/or creepage distance.

The present invention relates to a substrate structure for LED lighting, the structure being capable of improving the hemispherical intensity distribution of a lighting device in which an LED is used, thereby improving the light efficiency of the lighting device. The substrate structure includes a first substrate for mounting a first LED thereon and three second substrates, each for mounting a second LED thereon. The second substrates are coupled to the first substrate such that the second substrates are perpendicular to the first substrate and are arranged at an angular interval which is within a range of 115 to 125 with respect to each other in a cross-sectional view taken parallel to the first substrate. One or more second substrates of the three second substrates are provided with one or more control circuits for controlling operation of either of or both of the first LED and the second LED, in which the control circuit is disposed in an end portion of the second substrate in a direction perpendicular to the first substrate.

A rectification module includes a transformer, a connecting unit and a rectification unit. The transformer includes a first lateral region, a second lateral region and at least one secondary winding assembly. The second lateral region is located beside the first lateral region. The secondary winding assembly includes plural outlet ends. The plural outlet ends are arranged near the first lateral region. The connecting unit is located at the first lateral region, and includes plural conducting parts. Each of the conducting parts includes at least one opening and at least one connecting structure. The conducting parts are partially or completely stacked on each other. The outlet ends are accommodated within the corresponding openings. The conducting parts are fixed on the first lateral region. The connecting structures face the second lateral region. The rectification unit includes a circuit board and plural rectifier components.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

An electrical connector for a circuit card assembly including a PCB includes a mating housing having a mating end movable relative to the PCB and contact modules coupled to the mating housing including signal contacts having a mating conductor, a mounting conductor and a flexible conductor. The flexible conductor is flexible to allow relative movement of the mating conductor relative to the mounting conductor. The flexible conductor has a bent portion changing shape. The contact modules have ground contacts providing electrical shielding for the signal contacts. The ground contacts include covers extending along and providing shielding along at least one side of the bent portion of the corresponding signal contact.

A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.