A printed circuit board assembly includes a first printed circuit board having a first surface and a second surface that is opposite the first surface and including a slit portion and a second printed circuit board having a third surface and a fourth surface that is opposite the third surface and including a first end portion and a second end portion that is opposite the first end portion. The first end portion is fitted in the slit portion in such a manner that a tip of the first end portion protrudes from the second surface. The first printed circuit board includes a plurality of first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes a plurality of second electrodes arranged in the first end portion on the third surface and the fourth surface, and the plurality of second electrodes are joined to the plurality of first electrodes with solder. The first printed circuit board further includes a support fixed to the first surface. The second printed circuit board is attached to the support by an adhesive substance.

An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.

The application relates to a galvanic separating apparatus, including a printed circuit board, the printed circuit board including a first soldering pad, a second soldering pad and a recess, whereby the pads are arranged on a lower side of the printed circuit board thereby defining a clearance and/or creepage distance between the pads, and the recess is arranged between the pads, a primary insulated winding layer connected to the first soldering pad and a second insulated winding layer connected to the second soldering part, whereby the winding layers are arranged on an upper side of the printed circuit board, and an insulating layer, whereby the insulating layer extends from the upper side through the recess and protrudes on the lower side beyond the printed circuit board thereby increasing the clearance and/or creepage distance.

An electronic device includes a slot, and a backboard that is disposed on the depth side in the slot and is electrically connected to a printed circuit board inserted in the slot. The electronic device further includes a casing having the slot formed therein, the casing being configured to accommodate therein at least part of the backboard, and a cover member configured to be attachable to and removable from the casing. When attached to the casing, the cover member together with the casing forms the external appearance of the electronic device. The cover member is attached to the backboard integrally.

A disclosed expansion socket may include a primary slot and a secondary slot, each mounted to a receiver printed circuit board and electrically coupled to a central processing unit via a computing bus. The primary slot may be dimensioned to receive a primary pinout disposed within a primary portion of an edge connector disposed on a connecting edge of a presenter printed circuit board. Likewise, the secondary slot may be positioned and dimensioned to receive a secondary pinout, disposed within a secondary portion of the edge connector, when the primary slot receives the primary portion of the edge connector. Furthermore, the primary pinout and the secondary pinout may each conform to a compact pinout specification that is more compact than a pinout specification defined for the computing bus. Various other systems and methods are also disclosed.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

A printed wiring board (PWB) assembly includes a PWB main board defining a recess therein. An inlay is seated within the recess with a gap separating between the PWB main board and the inlay. Spacers are included within the gap to maintain gap width between the PWB main board and the inlay.

The present utility model provides an electronic device and a power module thereof. The power module of the present utility model includes: a first circuit board, a second circuit board, a radiator and a power device; where the heat dissipation surface of the power device is in thermal contact with the radiator, and the heat dissipation surface of the power device is parallel to the first surface of the first circuit board. The present utility model improves the heat dissipation efficiency of the power device by mounting the power device on the second circuit board and thermally contacting the radiating surface of the power device with the radiator, and at the same time, the arrangement of the second circuit board also makes the assembly of the entire power module more convenient.

A light-emitting module includes a first mounting board which has a first surface, a second surface opposite to the first surface, and a recess on the first surface. An opening passes through the first mounting board from a bottom surface of the recess to the second surface. A second mounting board has a mounting surface and a light-emitting element surface opposite to the mounting surface and is provided in the recess such that the light-emitting element surface faces the bottom surface of the recess. A light-emitting element is provided on the light-emitting element surface and configured to emit light through the opening. An elastic cushion is provided between the bottom surface and the light-emitting element surface. The second mounting board projects from the first surface of the first mounting board when a force pressing the second mounting board toward the bottom surface of the recess is not applied.

A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.