Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.

A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

A circuit card assembly includes an electrical connector having a housing mounted to a PCB. The housing has a mounting end and a mating end extending between a front and a rear. The housing has a cavity at the mating end configured to receive a second electrical connector. The housing holds deflectable contacts having spring beams at the mating end having mating interfaces. The circuit card assembly includes a contact actuator in the cavity engaging the spring beams and moving the spring beams between compressed positions and released positions. The mating interfaces of the spring beams are spaced apart from the second electrical connector in the compressed positions and are configured to engage and electrically connect with the second electrical connector in the released positions.

A printed circuit board composite and a method for producing same. In the method for producing the printed circuit board composite, a first printed circuit board, in particular a sensor carrier printed circuit board, is connected in a form-fitting manner to a second printed circuit board, in particular a supporting printed circuit board. There is also described a printed circuit board composite.

The present invention relates to a substrate structure for LED lighting, the structure being capable of improving the hemispherical intensity distribution of a lighting device in which an LED is used, thereby improving the light efficiency of the lighting device. The substrate structure includes a first substrate for mounting a first LED thereon and three second substrates, each for mounting a second LED thereon. The second substrates are coupled to the first substrate such that the second substrates are perpendicular to the first substrate and are arranged at an angular interval which is within a range of 115 to 125 with respect to each other in a cross-sectional view taken parallel to the first substrate. One or more second substrates of the three second substrates are provided with one or more control circuits for controlling operation of either of or both of the first LED and the second LED, in which the control circuit is disposed in an end portion of the second substrate in a direction perpendicular to the first substrate.

A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

A control module attached to a lighting fixture and having a front cover portion may comprise one or more sensors, such as a daylight and/or occupancy sensor, for sensing information through the front cover portion. The control module may have a main printed circuit board (PCB) that extends from a front side to a rear side of the control module, and a sensor PCB perpendicular to the main PCB to enable at least one sensor attached to the sensor PCB to face the front side of the control module. The main PCB may comprise a wireless communication circuit and an antenna for communicating radio frequency (RF) signals, wherein at least a portion of the antenna is located within a plastic lip of the front cover portion of the control module. The control module may further have a conductive enclosure to reduce radio-frequency interference noise from coupling into the antenna.

Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.