A composite electronic component includes a composite body including a multilayer ceramic capacitor including a first ceramic body in which dielectric layers and internal electrodes disposed to oppose each other with a respective one of the dielectric layers interposed therebetween are layered, and first and second external electrodes disposed on both ends of the first ceramic body; and a ceramic chip disposed below the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and respectively connected to the first and second external electrodes. A ratio (G1/M1) of a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction to a length (M1) of a margin portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

A printed circuit board assembly and a terminal are provided. The printed circuit board assembly includes: a first printed circuit board and a second printed circuit board, where the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints; the at least four solder joints include a first solder joint, a second solder joint, a third solder joint, and a fourth solder joint, the first solder joint communicates with the second solder joint, the third solder joint communicates with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint; and the printed circuit board cavity is a recess structure that is recessed inwards from a surface of the printed circuit board.

The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of it extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (16) formed. Supporting elements (23, 24, 25, 26) are formed on the contact face (21) of the heat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.

A flexible printed circuit board and a display device including the same are provided. An embodiment of a display device includes a display panel; a first circuit board attached to a first side of the display panel in a first direction; and a second circuit board attached to a second side of the first circuit board in the first direction, wherein the first circuit board includes a first bump area overlapping the display panel and a second bump area overlapping the second circuit board, the first bump area includes a plurality of first divided board portions arranged along a second direction crossing the first direction, and the first divided board portions of the plurality of first divided board portions partially overlap each other.

A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.

A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through hole that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The first through hole further includes a first metal film provided on an inner wall thereof. The interposer includes, on a side of a second external electrode in the length direction, a second through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The second through hole further includes a second metal film provided on an inner wall thereof. A first uncovered portion is provided, which is not covered by the first metal film, on a first surface of the inner wall of the first through hole, and a second uncovered portion is provided which is not covered by a second metal film on the first surface of the inner wall of the second through hole.

In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on a side of a second external electrode in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first joining electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second joining electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer.

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

A printed circuit board, PCB, based connector for connecting at least one wire to at least one microswitch in a position sensor for a motorised valve assembly is provided comprising a PCB comprising at least one first through hole and at least one second through hole. The at least one first through hole is configured to receive a solder pin of at least one microswitch. The at least one second through hole is configured to receive at least one wire and the PCB further comprises a slot configured to receive the at least one wire with an interference fit.