An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.

A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals is the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

An electronic device includes a printed circuit board having at least one edge and a strain relief including a plurality of overlapping, spaced-apart slots that cooperate with the at least one edge to define a resilient tab for redistributing strain induced in the printed circuit board.

A composite electronic component includes a composite body including a multilayer ceramic capacitor including a first ceramic body in which dielectric layers and internal electrodes disposed to oppose each other with a respective one of the dielectric layers interposed therebetween are layered, and first and second external electrodes disposed on both ends of the first ceramic body; and a ceramic chip disposed below the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and respectively connected to the first and second external electrodes. A ratio (G1/M1) of a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction to a length (M1) of a margin portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

A display device including: a display panel; a first substrate attached to a side of the display panel; and a second substrate attached to a side of the first substrate, wherein the display panel includes a first panel test pad and a second panel test pad, the first substrate includes a 1-1 circuit test lead overlapping and connected to the first panel test pad, a 1-2 circuit test lead overlapping and connected to the second panel test pad, a 2-1 circuit test lead overlapping and connected to the second substrate, a 1-1 test lead line connected to the 1-1 circuit test lead, a 1-2 test lead line connected to the 1-2 circuit test lead, and a first test lead line connected to the 2-1 circuit test lead, and the 1-1 test lead line and the 1-2 test lead line are connected to the first test lead line.

A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body and first and second external electrodes, and the ceramic chip is disposed below the multilayer ceramic capacitor and includes a second ceramic body having first and second terminal electrodes. The multilayer ceramic capacitor and the ceramic chip are coupled by solder disposed between the first and second external electrodes and the first and second terminal electrodes, and each angle (θ) defined by inner side surfaces of the solder, respectively disposed on inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body, and an upper plane of the second ceramic body of the ceramic chip satisfies 45 degrees or less.

A functional contactor is provided. The functional contactor contains a conductive elastic portion having elasticity and electrically contacting one of a circuit board of an electronic device, a bracket coupled to the circuit board, and a conductor which can come into contact with the human body; a substrate containing a plurality of dielectric layers; and a functional element embedded in the substrate so as to be electrically connected in series to the conductive elastic portion.

An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance Z.sub.T to the first PDN induced by the magnetically coupled inductor. The migrated impedance Z.sub.T to the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.