A fish eye camera is provided. A main circuit board is fixed to an inside of a base housing. A middle housing is formed to cover both of the main circuit board and a camera module and fixed to the base housing in a state in which a fish eye lens of the camera module is drawn from the middle housing. A bracket includes a bracket body, which is insertion-coupled to a plurality of light emitting diode (LED) substrates and elastically supports the plurality of LED substrates in a state in which the plurality of LED substrates are arranged around an outer side of the middle housing, and metal bodies which are inserted into the bracket body to be in contact with the LED substrates. A cover housing is formed to cover both of the bracket and the middle housing and fixed to the base housing.

A display device includes a first panel including a pad side area at one side of the first panel, a first optically transparent adhesive member on one surface of the first panel, a printed circuit board including a first attachment portion attached to the one surface of the first panel at the pad side area, a window on the first optically transparent adhesive member, a second optically transparent adhesive member on the other surface of the first panel, and a second panel on the second optically transparent adhesive member opposite the first panel, wherein the pad side area has a connection area at which the printed circuit board is attached to the first panel, and at which an edge of the first optically transparent adhesive member extends beyond an edge of the second optically transparent adhesive member, and a non-connection area at which the printed circuit board is not attached.

Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and L=|AA|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and L/L0.100 in which L is a length of the multilayer ceramic capacitor.

A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.

An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

An illumination dummy module is adapted for covering and protecting a card slot and includes a circuit board, a power pin, a clock pin, a data pin, at least one light source, a power converter, and a drive circuit. The circuit board includes an insertion part for inserting into the card slot. The power pin, the clock pin and the data pin are disposed to the insertion part, and the light source is disposed on the circuit board. The power converter receives input power from the card slot via the power pin, and converts the input power into output power. The drive circuit is disposed on the circuit board, and receives the output power from the power converter. The drive circuit also respectively receives a clock signal and a control command via the clock pin and the data pin, to enable or disable the light source.

A solid state drive apparatus includes a housing having an inner space and a plurality of vent channels penetrating a first side wall at a first side of the housing and a connector opening penetrating a second side wall at a second side of the housing opposite the first side of the housing, and a package substrate module in the inner space and having a package base substrate and a plurality of semiconductor chips mounted on the package base substrate. Each of the plurality of vent channels extends inwardly from an outer surface of the first side wall to an inner surface of the first side wall such that a vertical level of at least a portion of each of the plurality of vent channels varies between the outer surface and the inner surface.

An electronic device includes a printed circuit board having at least one edge and a strain relief including a plurality of overlapping, spaced-apart slots that cooperate with the at least one edge to define a resilient tab for redistributing strain induced in the printed circuit board.

An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.