An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

A display device includes a display panel. Circuit boards include power lines electrically connected to the display panel. A power supply supplies a power voltage to the display panel through the power lines. A resistance adjuster is disposed on at least one of the circuit boards, and adjusts a resistance of at least one power line among the power lines such that a current deviation between the power lines is within a reference range.

A host device includes surface mount conductive pads on a printed circuit board (PCB) for external peripheral communications. Conductive ink is printed on the conductive pads with a base member is printed over the conductive ink. Three-dimensional (3D) conductive wires are printed on the base member and extend along a housing to a new external port. Conductive ink is printed with a second base member and terminating ends of the wires are printed on the front of the base member establishing the new peripheral port for the host device. A peripheral device includes its own surface mount conductive pads which when aligned and brought into contact with the external port of the host device permits the host device and the peripheral device to establish a wired connection with one another without cables, without cable harnesses, and without port connectors.

A circuit board module includes a circuit board, a metal core printed circuit board, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembling region. The metal core printed circuit board is on the assembling region and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other. The second circuit layer is electrically connected to the circuit board. The thermal conductivity of the metal core printed circuit board is greater than the thermal conductivity of the substrate. The heating element is on the metal core printed circuit board and is electrically connected to the first circuit layer. An electronic device having the circuit board module is also provided.

An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

Provided is a mounting structure that can bond a first heat dissipation element to a second substrate through a hole in a first substrate without using a binder such as solder, an adhesive, or the like. A mounting structure of the present disclosure includes a first substrate (10) in which a penetrating hole (11) is formed, a second substrate (20) and a first heat dissipation element (30) overlapped with both surfaces of the first substrate (10), respectively, so as to cover the penetrating hole (11), and a second heat dissipation element (40) sandwiched and attached between the second substrate (20) and the first heat dissipation element (30) inside the penetrating hole (11).

The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

A bi-directional optical sub assembly connecting structure which is disclosed includes a first connecting plate, a second connecting plate, a connector, a first circuit, and a second circuit. The first connecting plate includes a plurality of first contacts for electrically connecting to a first transmitting end. The second connecting plate connects with the first connecting plate and includes a plurality of second contacts for electrically connecting to a second transmitting end. The connector connects with the first connecting plate for electrically connecting to a printed circuit board. The first circuit is located on the first connecting plate and electrically connected to the plurality of first contacts and the connector. The second circuit is located on the first connecting plate and the second connecting plate and electrically connected to the plurality of second contacts and the connector.

An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and L=|AA|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and L/L0.100 in which L is a length of the multilayer ceramic capacitor.