Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

An electronic module includes: a mount table including a first electrode mounting surface on which an electronic component is mounted; a plurality of electrode mount parts that are formed in the mount table and at which lands corresponding to a plurality of respective electrodes of the electronic component are formed on the first electrode mounting surface; a step part located between the plurality of electrode mount parts and including a predetermined step relative to the first electrode mounting surface of the mount table; and a solder withdrawing part at which an end part of a corresponding one of the lands is extended to the step part or a side surface of the mount table.

A composite part (sandwich or monolithic), including a rigid outer surface, to which is integrated an electronic instrumentation circuit, the electronic instrumentation circuit including a piezoelectric transducer, connected to a coil, an electronic control circuit, connected to a coil positioned facing the coil. The coil is printed on an insulating layer, printed directly on the rigid outer surface, the coil is printed on an insulating layer, covering the coil and the transducer, conducting tracks are printed on an insulating layer printed on at least one portion of the coil to be connected to it, the electronic control circuit being attached to the rigid outer surface and being connected to the tracks.

A camera module according to the present invention may comprise: a barrel that accommodates a lens therein; a printed circuit board formed under the barrel and mounted with an image sensor; a body portion integrally formed with the barrel; a holder comprising a leg portion formed by being extended downward from the lower end of the body portion to the same height as the image plane of the lens; and a fixing portion formed downward from the leg portion to have a predetermined thickness to fix the holder to the printed circuit board, wherein the thickness of the fixing portion may be equal to the height from the upper surface of the printed circuit board to the image plane of the image sensor.

An electronic-element mounting package includes a wiring substrate having a first surface and a wiring pattern thereon; a base having a second surface and a through hole whose opening is on the second surface; a signal line penetrating the through hole and having a first end exposed from an opening of the through hole; and an insulating member between an inner surface of the through hole and the signal line and has an end portion and a main portion. The end portion has an end surface on a side of the opening of the through hole, and the main portion is farther from the opening of the through hole than the end portion. The electronic-element mounting package also has a conductive joining material with which the wiring pattern and the first end are joined. Permittivity of the end portion is larger than permittivity of the main portion.

In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through hole that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The first through hole further includes a first metal film provided on an inner wall thereof. The interposer includes, on a side of a second external electrode in the length direction, a second through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The second through hole further includes a second metal film provided on an inner wall thereof. A first uncovered portion is provided, which is not covered by the first metal film, on a first surface of the inner wall of the first through hole, and a second uncovered portion is provided which is not covered by a second metal film on the first surface of the inner wall of the second through hole.

A capacitor and an electronic device comprising same are disclosed. An electronic device according to the present disclosure may comprise: a substrate; a plurality of capacitors mounted on the substrate, each of the plurality of capacitors including a case extending to accommodate an electrolyte therein, and a cap coupled to one end of the case in the direction in which the case extends configured to restrict scattering of the electrolyte; and a fixing member comprising a protrusion and configured to press the perimeters of the caps in the radial direction of the caps to fix the plurality of capacitors to the substrate.

A connection structure configured to connect a display panel and a circuit board, includes a flexible printed circuit, a first chip-on-film, and a second chip-on-film. The first chip-on-film and the second chip-on-film are coupled to one end of the flexible printed circuit. The first chip-on-film and the second chip-on-film are coupled to two surfaces of the flexible printed circuit that are opposite in a thickness direction of the flexible printed circuit.

A display device including: a display panel; a first substrate attached to a side of the display panel; and a second substrate attached to a side of the first substrate, wherein the display panel includes a first panel test pad and a second panel test pad, the first substrate includes a 1-1 circuit test lead overlapping and connected to the first panel test pad, a 1-2 circuit test lead overlapping and connected to the second panel test pad, a 2-1 circuit test lead overlapping and connected to the second substrate, a 1-1 test lead line connected to the 1-1 circuit test lead, a 1-2 test lead line connected to the 1-2 circuit test lead, and a first test lead line connected to the 2-1 circuit test lead, and the 1-1 test lead line and the 1-2 test lead line are connected to the first test lead line.

An example method for attaching a ball grid array chip to a circuit board includes providing an adapter for attaching a chip with a plurality of solder balls to a circuit board, the adapter having an adapter substrate made from a material having substantially the same coefficient of thermal expansion as the substrate used in the chip and having at least one electrical contact site on a mounting surface of the adapter substrate for engaging a solder ball on the ball grid array chip and a plurality of lead wires extending from each side of the adapter substrate. At least one of the lead wires is electrically connected to at least one electrical contact site on the adapter substrate.