According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

A flexible printed circuit board (FPCB) is disclosed. The FPCB can be employed to connect an interface card having connectors with a two-stage configuration to a connection destination of a portable information equipment. The FPCB includes a bend line located between an upper-stage terminal group and a lower-stage terminal group. The FPCB can be bent along the bend line to allow the upper-stage terminal group and the lower-stage terminal group to be mutually superimposed over each other. In addition, the upper-stage terminal group of the FPCB is connected to the upper-stage-side connector terminal group of the interface card, and the lower-stage terminal group of the FPCB is connected to the lower-stage-side connector terminal group of the interface card.

The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

A flexible circuit board assembly and a flexible display device include a first flexible circuit board, a T-shaped flexible circuit board, and a second flexible circuit board. The first flexible circuit board and the second flexible circuit board are located on a top of the T-shaped flexible circuit board and are coplanar with the T-shaped flexible circuit board. Two ends of a top of the T-shaped flexible circuit board are connected respectively to the first flexible circuit board and the second flexible circuit board perpendicularly.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

An electronic apparatus includes a flexible printed circuit board having a main body on which wiring pattern is formed, a connector having a connection terminal connected to the wiring constituting the wiring pattern, and a base body on which the connection terminal is fixed, and a casing. The main body is attached to the casing to be movable, the flexible printed circuit board has an extension part protruding from the main body and extending along with a ground included in the wiring pattern, the extension part bends in the middle of extending to be capable of expansion and contraction, and has a mounting part fixed to the casing on the tip side thereof, the mounting part is provided with a ground terminal connected to the ground extended, and the ground terminal is electrically connected to the casing in the state that the mounting part is fixed to the casing.

Devices and methods for encapsulating a portion of a wound dressing with a coating are disclosed. In some embodiments, a method can comprise positioning a substantially flexible wound contact layer of the wound dressing on a perforated plate. The wound contact layer can include a first side supporting a plurality of electronic components protruding from a surface of the first side and a second side opposite the first side. The second side can be substantially smooth. The method can further comprise applying a vacuum to the wound contact layer through perforations in the perforated plate to hold the wound contact layer against the perforated plate and coating the wound contact layer with a coating.

An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.

An electronic device according to an embodiment includes: a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first printed circuit board (PCB) positioned in the first temple, and a flexible printed circuit board electrically connected to the first PCB, and the flexible printed circuit board includes a first rigid portion connected to the first PCB, a first flexible portion extending from the first rigid portion in a first direction, and a second flexible portion extending from the first rigid portion in a second direction different from the first direction, the second flexible portion being bent in a first bending area to overlap at least a portion of the first flexible portion.

A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and/or two side of a flexible circuit board and electrically connected therewith in advance.