A device comprises a first circuit member, a second circuit member and a third circuit member. The first circuit member comprises a first body for performing the function of the first circuit member and a first flexible board formed with a first integrated-electrode portion including first electrodes. The second circuit member comprises a second body for performing the function of the second circuit member and a second flexible board formed with a second integrated-electrode portion including second electrodes. The third circuit member comprises a third body for performing the function of the third circuit member and a third flexible board formed with a third integrated-electrode portion including third electrodes. The first integrated-electrode portion, the second integrated-electrode portion and the third integrated-electrode portion lie over each other in an upper-lower direction. The first body, second body and the third body are apart from each other when seen along the upper-lower direction.

The present invention provides an IR window assembly in which an IR window, an IR sensor, and a portion of a PCB, on which the IR sensor is mounted, are structurally integrated. The IR window assembly is mounted on the FPCB, and mounted in a position where infrared detection is easy in audio devices such as headsets.

To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.

An imaging module includes an electric cable including a plurality of wirings, an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable, and a flexible wiring board configured to electrically connect the imager and the electric cable. The wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager. At least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions.

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

A flexible printed circuit board and an electronic device using the same are provided. The electronic device includes a first casing, a second casing, and a printed circuit board combination. The printed circuit board combination includes a first printed circuit board, a second printed circuit board, and a flexible printed circuit board. The flexible printed circuit board includes a body portion, a first extending end, and a second extending end. The body portion defines an opening. The first extending end bends from a first side of the body portion toward the body portion and extends toward a first direction after passing through the opening to connect the first printed circuit board. The second extending end extends from a second side of the body portion toward a second direction to connect the second printed circuit board.

Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.

A battery pack including at least one battery cell including a first surface and a second surface forming opposite ends along a height direction thereof, and an outer circumferential surface connecting the first surface and the second surface; and a flexible circuit board configured to obtain state information of the at least one battery cell, the flexible circuit board including a corrugated main body at least partially surrounding the outer circumferential surface of the at least one battery cell, and branch portions extending from the main body onto the first surface or the second surface of the at least one battery cell.

Provided is a frame assembly for fixing a plurality of stacked battery cells. The frame assembly may include: a frame including an upper surface, a first side surface connected to a first end of the upper surface and a second side surface connected to a second end of the upper surface, the frame being configured to enclose the plurality of battery cells; a plurality of first bus bars disposed on the first side surface; a plurality of second bus bars disposed on the second side surface; and a flexible printed circuit board disposed along the upper surface, the first side surface, and the second side surface of the frame, the flexible printed circuit board being configured to sense the plurality of battery cells.