An electronic device for providing feedback corresponding to an input for a housing may include a housing comprising a flexible material, a flexible printed circuit board (FPCB) positioned within the housing, at least one distance measurement sensor operatively coupled to the FPCB, and configured to transmit a signal to at least some area of the housing at given periods and further configured to receive a signal reflected by the some area, and at least one processor operatively coupled to the FPCB and the at least one distance measurement sensor. The at least one processor may be configured to control the electronic device to: receive data from the at least one distance measurement sensor, identify an external input for at least some area of the housing based on the received data, and provide feedback corresponding to the identified external input.

A flexible circuit board according to an embodiment includes a first signal line extending on a first plane, a first dielectric extending in an extension direction of the first signal line while being in contact with the first signal line, a second signal line extending on a second plane parallel with the first plane, and a second dielectric extending in an extension direction of the second signal line while being in contact with the second signal line. The first signal line includes a first part overlapped with the second signal line and a second part not overlapped with the second signal line when viewed in a normal direction of the first plane, and the second signal line includes a first part overlapped with the first signal line and a second part not overlapped with the first signal line when viewed in the normal direction.

One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

A detection package structure, comprising: an exterior tube; a detection assembly, a flexible printed circuit (FPC), a module base, and lighting members which are all disposed inside the exterior tube. The FPC includes a main flexible plate and minor flexible plates. The invention uses detection conductive materials and detection wiring parts to implement electric conduction-directed soldering, whereby to prevent from direct soldering of cables and detection assembly and enlarge soldering spots. It can lower the difficulty of soldering operation, enhance the strength and reliability of soldering, promote the stability of the electric conduction-directed soldering in various dynamic states. Dimensional errors or external force are less likely to affect the performance of electric-conduction-directed soldering due to the flexibility of the FPC which can guarantee electric connection and convenience assemblage and improve the stability of electric conduction-directed soldering. The bendability of the FPC favors reducing the radial size of the package structure.

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.

The light input efficiency of a light-emitting device into a circular disc-shaped or elliptical disc-shaped light guide plate is increased. A light-emitting device includes a first light-emitting unit (12a) that includes a plurality of light-emitting elements (L1 to L5) arranged curvilinearly, a second light-emitting unit (12b) that includes a plurality of light-emitting elements (L6 to L10) arranged curvilinearly, and a coupling portion (12c) that is disposed so as to coincide with a region (SA) sandwiched by the first and second light-emitting units and couples the first and second light-emitting units.

A method for assembling a battery module including a unified connection array with a flexible connector is described. The flexible connector can include a plurality of pads that are secured to a central spine. The flexible connector may be a single piece connector. The flexible connector can include monitors that are mounted to the flexible connector to gather data regarding battery cells of the battery module.