A flexible display device includes a flexible display panel and a chip on film (COF) bonded to the flexible display panel; wherein the flexible display panel is divided into a display region, a bonding region on a side of the display region, and a bending region between the display region and the bonding region; wherein the COF comprises a main body portion and two expansion bonding portions respectively disposed at two ends of one side of the main body portion; wherein an edge of the main body portion adjacent to the two expansion bonding portions are disposed with a plurality of connection pins; wherein the COF is bonded to the bonding region of the flexible display panel through the plurality of connection pins.

One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

A display device and a flexible circuit board are provided. The display device includes: a display panel having a first bonding region, the first bonding region being provided with a plurality of first connection terminals; a touch panel having a second bonding region, the second bonding region being provided with a plurality of second connection terminals; a flexible circuit board having a first surface and a second surface opposite to the first surface; first conductive structures disposed on the first surface of the flexible circuit board and configured to be connected with the plurality of first connection terminals; second conductive structures, disposed on the second surface of the flexible circuit board and configured to be connected with the plurality of second connection terminals.

A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.

The disclosure provides a display panel and a display device. In an array substrate of the display panel, at least two protrusions are defined on a side of a non-display region away from a display region to form an extending portion. A recess is defined between adjacent protrusions. A driver chip is disposed in a space between a periphery of a display region and a periphery of a non-display region. Distances between the driver chip, the periphery of the display region, and the periphery of the non-display region are increased. A bending section of a flexible circuit board is disposed in the recess. As a result, width of the non-display region will not be increased.

The disclosure provides a display panel and a display device. In an array substrate of the display panel, at least two protrusions are defined on a side of a non-display region away from a display region to form an extending portion. A recess is defined between adjacent protrusions. A driver chip is disposed in a space between a periphery of a display region and a periphery of a non-display region. Distances between the driver chip, the periphery of the display region, and the periphery of the non-display region are increased. A bending section of a flexible circuit board is disposed in the recess. As a result, width of the non-display region will not be increased.

A lighting engine, system, and method of fabrication are described. The system includes a chassis with a ridge extending from a bottom that defines inner and outer cavities. A flexible printed circuit (FPC) is disposed in contact with a wall of the inner and outer cavities and on the ridge top and is connected to wiring retained within bosses in the outer cavity. LEDs are mounted on the FPC to emit light toward a center of the cavity. A light guide disposed has an edge that opposes the LEDs and receives light emitted by the LEDs. The FPC has a polyimide insulator coupled with a pressure-sensitive adhesive (PSA), a copper layer on the polyimide insulator, and a high-reflectivity white coverlay on the copper layer. Other apparatuses, systems, and methods are also disclosed.