An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

A flexible circuit board includes a main board, a first connecting plate, and a second connecting plate; a side surface of the first connecting plate is connected to a first side surface of the main board, and an included angle between the main board and the first connecting plate is a first preset angle; a side surface of the second connecting plate is connected to the first side surface of the main board, and an included angle between the main board and the second connecting plate is a second preset angle; and the first preset angle and the second preset angle are both greater than 0 degree and less than 180 degrees.

A display device includes a display panel, a first circuit board, a control unit disposed on the first circuit board, a second circuit board, and a coupling film which electrically couples the control unit and the second circuit board to each other. The coupling film includes a first coupling part including a first region attached to the first circuit board, and a second region overlapping the display panel when viewed in a thickness direction of the display panel, a second coupling part including a third region attached to the second circuit board, and a fourth region overlapping the display panel when viewed in the thickness direction of the display panel, and a third coupling part coupled to each of the second region and the fourth region to electrically couple the first coupling part and the second coupling part to each other.

A display device includes a display panel, a window, a metal layer, and a first conductive tape. The display panel includes a display area, a non-display area, and a bending area disposed between the display area and the non-display area and bent such that the non-display area overlaps the display area. The window is disposed on a first surface of the display panel and includes a protruding portion overlapping the non-display area. The metal layer is disposed on a second surface of the display panel. The second surface is opposite to the first surface. The first conductive tape connects the protruding portion of the window to the metal layer.

A bending apparatus including a stage on which a bending object is positioned, a bending bar, a drive unit connected to the bending bar and configured to move the bending bar according to a standard route to bend the bending object by coming into contact with the bending object, and a measuring unit that measures a movement route of the bending bar.

A filter comprising a flexible PCB with one or more signal tracks on one side. A electromagnetically absorbing material covers the signal tracks. An insulating material may be provided between the signal tracks and the electromagnetically absorbing material. The PCB is then folded or rolled to take up less space. The PCB may be first folded and then rolled to have both ends of the signal tracks available at the outer portion of the roll.

This invention provides an electro-optical module with reduced noise in driving voltage. The invention can include a power supply substrate that is arranged separately from the flexible substrate having a driver, so that the noise of the driving voltage supplied from the power supply substrate is reduced. The electro-optical module includes a first connecting portion connecting a first end of the flexible substrate to a display panel and configured to receive a signal from the driver, and a second connecting portion connecting the first end of the flexible substrate to the display panel and configured to receive the driving voltage from a third connecting portion at a second end of the flexible substrate.

A flexible circuit member, a preparation method thereof, and a battery apparatus are provided. The flexible circuit member includes an extension unit having a first body portion, a second body portion, and a stacking portion connected between the first and second body portions. The stacking portion has at least two layers due to the folding processing. A first end of the extension unit in a long-axis direction is an end portion of the first body portion that is not connected to the stacking portion. A second end of the extension unit in the long-axis direction is an end portion of the second body portion that is not connected to the stacking portion. A conductive wire harness for electrical signal transmission extends from the first end to the second end. After the stacking portion is unfolded, a distance between the first and second ends in the long-axis direction decreases.

Sheet comprising a flexible support and a coating at least partially covering at least one face of the support, the support being made of a support material exhibiting dielectric properties, the coating being made of a coating material different from the support material and exhibiting magneto-dielectric properties or dielectric properties.

A circuit board includes a support member having a first major surface and a second major surface opposite the first major surface, and an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member, wherein the first surface of the interconnect substrate includes a circuit region where an electronic component is mounted and at least one electrode region where at least one external electrode is arranged, wherein the circuit region is disposed indirectly on the first major surface of the support member, and wherein the interconnect substrate is bent around the support member, and at least part of the electrode region is disposed indirectly on the second major surface of the support member.