To provide a circuit board in which a curvature of a display surface can be controlled, or to provide a highly portable circuit board. A circuit board includes a substrate with flexibility and a curvature control mechanism. The curvature control mechanism includes a first electromagnet and a second electromagnet provided over a first surface of the substrate, an insulating film provided over the first and second electromagnets, and wirings electrically connected to the first and second electromagnets.

An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

An electronic element assembly includes a first electronic element, an electronic element board and a flexible circuit. The first electronic element is disposed on the electronic element board, and the electronic element board includes a first circuit and a second circuit, wherein the first circuit and the second circuit are disposed on relative sides of the first electronic element, respectively. The flexible circuit is disposed on the electronic element board, and the flexible circuit includes a connecting portion, a bending portion and an electronic path. The connecting portion is connected to the electronic element board. The bending portion is disposed on a side of the connecting portion away from the first electronic element. At least one portion of the electronic path is disposed on the bending portion.

A multifunctional charging and data adapter includes a housing, a plurality of data transmission connection holes, a first circuit board, a second circuit board, a charging plug, a charging module and a flexible circuit board. The first circuit board is provided with at least one of the data transmission connection holes. The second circuit board is adjacent to the first circuit board and is provided with at least another of the data transmission connection holes. The charging plug and the charging module are configured to receive external electrical power via the charging plug and transmit the external power to at least one of the data transmission connection holes via the first or second circuit board. The flexible circuit board is configured to be electrically connected between the first and second circuit boards so as to provide an electrical signal transmission path between the first and second circuit boards.

A package structure and a method of manufacturing a package structure are provided. The package structure includes a bent flexible carrier, a first component, and a flexible encapsulation layer. The first component is disposed on the bent flexible carrier. The flexible encapsulation layer encapsulates the first component and the bent flexible carrier.