Patent classifications
H05K2201/058
Method of supplying electrical power from rigid printed circuit board to another rigid printed circuit board in rigid-flex printed circuit board array
A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.
FLEXIBLE DISPLAY DEVICE
A flexible display device includes a flexible display panel and a chip on film (COF) bonded to the flexible display panel; wherein the flexible display panel is divided into a display region, a bonding region on a side of the display region, and a bending region between the display region and the bonding region; wherein the COF comprises a main body portion and two expansion bonding portions respectively disposed at two ends of one side of the main body portion; wherein an edge of the main body portion adjacent to the two expansion bonding portions are disposed with a plurality of connection pins; wherein the COF is bonded to the bonding region of the flexible display panel through the plurality of connection pins.
Display device and flexible circuit board
A display device and a flexible circuit board are provided. The display device includes: a display panel having a first bonding region, the first bonding region being provided with a plurality of first connection terminals; a touch panel having a second bonding region, the second bonding region being provided with a plurality of second connection terminals; a flexible circuit board having a first surface and a second surface opposite to the first surface; first conductive structures disposed on the first surface of the flexible circuit board and configured to be connected with the plurality of first connection terminals; second conductive structures, disposed on the second surface of the flexible circuit board and configured to be connected with the plurality of second connection terminals.
Implantable electrical connecting device
An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.
DISPLAY DEVICE
A display device may include a main flexible printed circuit including a first alignment mark and electrically connected to a first panel; and a touch flexible printed circuit including a second alignment mark and electrically connected to a second panel that is perpendicular to the first panel, wherein the main flexible printed circuit is electrically connected to the touch flexible printed circuit through a pad region, and the touch flexible printed circuit includes a first overcoat region disposed between the first alignment mark and the second alignment mark.
Electronic device including speaker module
An electronic device is provided. The electronic device includes a housing, a display that is visually exposed through one surface of the housing and that includes a display panel including a pixel array and a layer group including a plurality of layers stacked on the display panel, a printed circuit board disposed in the housing, a piezo unit attached to a rear surface of the display panel, and a flexible printed circuit board (FPCB) that is connected to the piezo unit and that extends to the printed circuit board, the flexible printed circuit board including a coil that surrounds at least part of the piezo unit.
Interconnection of printed circuit boards with nanowires
A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.
ELECTRONIC DEVICE AND METHOD FOR FORMING ELECTRONIC DEVICE
In the disclosed solution, an electronic device (1) includes a printed circuit board (4) having a flexible part (4c), and a support part (5). The printed circuit board is bent by making use of the flexible part (4c) so that at least a part of the printed circuit board is over a second part of the printed circuit board (4). The support part (5) is adapted to support the flexible part (4c).
Display apparatus
The present disclosure provides a display apparatus, a display panel of which includes a panel chip; a second bonding region of a main circuit board is provided with second display terminals coupled with first display terminals and second touch control terminals coupled with first touch control terminals; each of segment touch control lines includes a first segment coupled between one second touch control terminal and one main connector in a first region, and a segment coupled between a touch control chip and one main connector in a second region; a third region and a fourth region of a jumper connection circuit board are bonded with the first region and the second region respectively; the segment touch control lines are in one-to-one correspondence with jumper connection lines, each jumper connection line is coupled between one jumper connector in the third region and one jumper connector in the fourth region.
Overlap joint flex circuit board mating
An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.