The utility model relates to an electric driver and an illumination device. The electric driver comprises: a carrier; a first electrical component and a second electrical component, wherein the first electrical component and the second electrical component are provided on the carrier; and a heat insulation structure, wherein the second electrical component comprises a first heat insulator surrounding the second electrical component and a second heat insulator surrounding the first heat insulator, wherein a gap is provided between the first heat insulator and a second heat insulator. The electric driver according to the present utility model improves the lifetime of capacitors, is low-cost, and has a compact structure.

A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic element disposed on the circuit layer. The heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer.

To provide a mounting board and an electric apparatus equipped with the mounting board. The mounting board includes an electronic component, a printed circuit board, a heat spreader, and a heat dissipation component. A first insulating member and a second insulating member each being an insulator are arranged between the electronic component and the heat spreader and between the heat spreader and the heat dissipation component, respectively, and a hardness of the first insulating member and a hardness of the second insulating member are lower than a hardness of the heat spreader.

A network device that includes a temperature sensor module is provided. The network device can include a host printed circuit board, one or more processors mounted on a surface of the host printed circuit board, a port protruding from the surface of the host printed circuit board, and a temperature sensor module that is raised over the surface of the host printed circuit board to provide thermal decoupling from the surface of the host printed circuit board. The temperature sensor module can include a sensor printed circuit board, a temperature sensor integrated circuit die disposed on a first side of the sensor printed circuit board, and an exposed conductive pad disposed on a second side of the sensor printed circuit board. The temperature sensor module can include multiple exposed contacts or a plug configured to mate with the protruding port.

An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.

A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a fist silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation, material. Yet further disclosed is a method for producing the heat-insulation material.

A circuit assembly includes a circuit board having an insulating board in which a conductive path is formed on an insulating plate and a plurality of busbars that are bonded to one side of the insulating board, an insulating layer that is printed to the plurality of busbars so as to couple adjacent ones of the plurality of busbars to each other, a heat dissipation member on which the insulating layer is placed and which is configured to dissipate heat conducted from the insulating layer, a fixing member that is configured to fix the circuit board and the heat dissipation member to each other in a state in which the insulating layer is sandwiched between the heat dissipation member and the plurality of busbars.

This copper/ceramic bonded body includes a copper member consisting of copper or a copper alloy and a ceramic member, wherein the copper member is bonded to the ceramic member, an active metal compound layer consisting of an active metal compound is formed on a side of the ceramic member at a bonded interface between the ceramic member and the copper member, microcracks that extend from the bonded interface toward an inner side of the ceramic member are present in the ceramic member, and at least a part of the microcracks are filled with the active metal compound.

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

A thermal interface arrangement for a heater system, the thermal interface arrangement being arranged for establishing a thermal interface with a body to be heated, the arrangement including a support structure and at least one interface assembly mounted on the support structure. The interface assembly includes an interface member arranged to engage the body to form a thermal interface, and at least one biasing member acting between the support structure and the interface member to bias the interface member away from the support structure and into engagement with the body, in use. The biasing member includes thermally insulating material so that the biasing member is configured to resist heat transfer from the interface member to the support structure.