A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

A cooling apparatus is provided, including a jet plate and a carrier plate provided with an accommodating groove, a coolant inlet, and a coolant outlet. The jet plate is in the accommodating groove, with nozzles provided on the jet plate in a protruding manner. A distribution cavity is between the jet plate and the carrier plate, and the distribution cavity communicates with the coolant inlet, which is for injection of cooling liquid. A collection cavity for backflow of the cooling liquid is formed in the accommodating groove, and is separated from the distribution cavity. The coolant outlet communicates with the collection cavity. The cooling liquid is distributed to the jet plate through the distribution cavity, and is sprayed to the collection cavity through the nozzles for heat exchange, and the cooling liquid obtained through heat exchange is converged in the collection cavity and flows out through the coolant outlet.

A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

The present invention relates to a method for exchanging heat with an object said method comprising using a heat transfer fluid wherein said heat transfer fluid comprises one or more chemical compounds having the general formula (I) wherein: —R.sub.f can be any C.sub.1-C.sub.10 fluorinated linear or branched carbon chain which can be partially or fully fluorinated, and can comprise O or S atoms, —X, Y and Z can be independently selected from halogens or hydrogen, with the provision that at least one of X, Y or Z is a halogen.

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An arrangement for exchanging heat between two bodies comprises a circuit board, having at least one first via and at least one second via, wherein at least one heat exchange structure is integrated in the circuit board, wherein the at least one heat exchange structure comprises two heat exchange layers and an intermediate layer arranged between the two heat exchange layers, wherein the two heat exchange layers are thermally joined to each other and electrically separated from each other by the intermediate layer, wherein a first heat exchange layer is associated with the first body and can be brought into thermal contact with it and a second heat exchange layer is associated with the second body and can be brought into thermal contact with it, wherein the at least one first via and the at least one second via are each led through the two heat exchange layers and the intermediate layer arranged between the two heat exchange layers, wherein the at least one first via is in contact only with the first heat exchange layer and is insulated from the second heat exchange layer, and wherein the at least one second via is in contact only with the second heat exchange layer and is insulated from the first heat exchange layer.

An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.

A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.

An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

Disclosed are heat pipes of the type having a condenser section in which gaseous refrigerant is condensed to produce liquid refrigerant comprising: (a) at least one closed pipe comprising: (i) a condenser section, (ii) a first evaporator section in fluid communication with said condenser section; and (iii) at least a second evaporator section in fluid communication with said condenser section; (b) refrigerant contained in said heat pipe; (c) at least a first liquid flow path leading a first portion of liquid refrigerant condensed in said condenser section to said first evaporator section; and (d) at least a second liquid flow path leading a second portion of liquid refrigerant condensed in said condenser section to said second evaporator section, wherein said second evaporator section comprises a reservoir holding liquid refrigerant at a location different than said first evaporator section.