A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.

A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0 W/mk and a dielectric breakdown strength of at least 3.0 kV/mm.

A method of manufacturing a component carrier, includes providing a base structure having a main surface that is at least partially covered by a component fixation structure; providing a component, the component intrinsically comprising warpage; mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; and fixating the component to the component carrier through the component fixation structure.

A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 μm to 0.5 μm, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.

A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.

Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50%, and a total thickness of the polyimide layer is in a range of from about 50 to about 85%. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 μm, and the total thickness of the composite layer is in a range of from about 40 to about 60 μm.

A physical quantity detector includes a housing, a circuit board, a cover, a resin member, a conductor, and a conductive member. The circuit board includes a board surface. The cover faces the board surface and defines, together with the hosing, a passage through which the target fluid flows. The conductor includes a passage side portion and a connecting portion. The conductive member electrically connects the connecting portion to the circuit board. The conductive member includes a first end in the thickness direction facing a contact target that is either one of the connecting portion or the board surface. The first end includes a contact portion in contact with the contact target and a contactless portion away from the contact target in the thickness direction.

A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.

A rigid flex circuit board is provided, including a flexible circuit board, which includes a core layer, first and second cover layers, first and second bonding layers, first and second dielectric layers, and first and second superposition layers. The core layer includes first and second core circuit layers. The first and second cover layers cover a portion of the first and second core circuit layers. The first and second bonding layers cover a portion of the first and second cover layers. The first and second dielectric layers cover a portion of the first and second core circuit layers and the first and second cover layers. The first superposition layer is disposed on the first bonding layer and the first dielectric layer, and the second superposition layer is disposed on the second bonding layer and the second dielectric layer.