The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

An electric connector terminal configuration structure includes an insulating body, a terminal set disposed inside a base of the insulating body and including conductive terminals arranged in upper and lower rows, and a circuit board connected to terminal set and including a first contact set and a second ground set. The first contact set is electrically connected to the terminal set, to transmit differential pair signals, ground signals and non-differential pair signals. The second contact set is electrically connected to the first contact set and has the same signal transmission configuration as the first contact set, and in the second contact set, an interval of contacts for transmitting differential pair signals is lower than the interval of a contact for transmitting a ground signal and an adjacent contact for transmitting the differential pair signal, to solve the high frequency impedance matching problem, thereby matching the HDMI 2.1 specification.

The present disclosure provides a circuit board assembly and a display device. The circuit board assembly comprises a circuit board main body printed with a ground line which is grounded, and an electronic component and an electrostatic shielding cover defined on a side of the circuit board main body. The electrostatic shield cover covers the electronic component and electrically connects with the ground line.

An electromagnetic shield is adapted to be mounted on a circuit board and to shield electromagnetic radiation produced by an electronic component. The electromagnetic shield includes a cover unit and a conductive surrounding wall. The cover unit includes a metallic main body having an abutment portion adapted to be connected to the electronic component. The conductive surrounding wall is connected to the cover unit, is adapted to abut tightly against the circuit board, and is adapted to cooperate with the main body and the circuit board to define an electromagnetic shielding space that encloses the electronic component.

This disclosure relates to a two-piece shield comprising a fence having integrally formed sidewalls and an upper frame, and a lid. The lid attaches to the fence, which is attached to the circuit board. The fence is a relatively thick, flexible material for supporting the lid. The fence has a recess so that the lid can be recessed into the fence to position the lid closer to the circuit for enhanced heat absorption. The lid could be made of a thicker heat absorbing material than the fence, again to facilitate heat absorption. The lid can be press-fit into the recess of the fence. The fence and lid can have a dovetail configuration to retain the lid in the fence.

The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S.sub.2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S.sub.1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.