A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

A component carrier including a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component embedded in the stack, and a heat removal body configured for removing heat from the component is connected to the stack and preferably to the component. The heat removal body including a component-sided first heat removal structure thermally coupled with the component, and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component.

A package capable of eliminating bubble formation includes a composite substrate having an accommodating space, an upper conductive layer and a lower conductive layer; at least one conductive via formed in the composite substrate and electrically connected to the upper conductive layer and the lower conductive layer; a die mounted in the accommodating space and having a first surface and a second surface; a molding layer covering the composite substrate and filled in the at least one conductive via and the accommodating space to wrap the die; the support layer buried in the molding layer and located above the upper conductive layer; a redistribution layer mounted on the molding layer and electrically connected to the first surface of the die and the upper conductive layer; wherein the molding layer is formed by laminating a first insulating sheet and a second insulating sheet.

A stretchable device that includes: a first substrate having stretchability; a first wiring on a first main surface of the first substrate; a second substrate facing the first substrate in a first direction that is a thickness direction of the first substrate and connected to the first substrate; a second wiring on a first main surface of the second substrate, facing the first wiring in the first direction, and electrically connected to the first wiring; and a first protective layer on the first main surface of the first substrate so as to cover a part of the first wiring, wherein the first substrate and the first protective layer overlap each other in a first overlapping region, the first wiring and the second wiring are electrically connected in a wiring region, and the first overlapping region is separated from the wiring region when viewed from the first direction.

A circuit board, comprising a thinned area and a non-thinned area, wherein the non-thinned area comprises a first electromagnetic shielding layer, a first composite structure layer and a substrate layer, which are sequentially stacked; the first composite structure layer comprises a first sub-structure layer and a second sub-structure layer which are sequentially stacked in a direction away from the substrate layer, and the first sub-structure layer and the second sub-structure layer each comprises at least one circuit layer; the thinned area comprises a third electromagnetic shielding layer, a first substructure layer and a substrate layer, which are sequentially stacked; an insulating material is provided at the junction of the thinned area and the non-thinned area, and the insulating material isolates the circuit layer in the second substructure layer from the third electromagnetic shielding layer.

According to one embodiment, a printed circuit board includes a first conductive layer on an insulating layer, including connection pads, a first mounting pad, a second mounting pad, a second wiring connecting the first mounting pad and one of the connection pads, and a first reinforcing pattern extending from the second mounting pad, a second conductive layer on another surface of the insulating layer, including a third wiring connected to one of the connection pads, and a conductive via connecting the second mounting pad and the third wiring. The second conductive layer includes a pad portion on the third wiring, opposed to the second mounting pad, and a third reinforcing pattern extending from the pad portion and opposed to the first reinforcing pattern.

A carrier structure is provided and includes: a lower shielding layer including lower shielding areas and a first separation lane; a circuit layer including conductive traces, a grounding block, and second separation lanes whose locations do not correspond to the location of the first separation lane; an upper shielding layer including upper shielding areas and a third separation lane whose location does not correspond to the locations of the second separation lanes; and at least two insulation layers with a plurality of conductive vias formed therein. Therefore, the edges of the separation lanes in the layers of the carrier structure and the electronic package having the same do not correspond to each other in the vertical direction to form structural weakness, thereby preventing cracks from occurring to the outer protective layer or even the entire carrier structure, such that the reliability of the product can be improved.

A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.