A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.

A filter is disposed on a base board. The filter includes a first portion, a second portion, a ground portion, a first coupling portion and a second coupling portion. The first portion is disposed on a first layer in the base board to input signals. The second portion is disposed on the first layer to output signals. The ground portion is disposed on a second layer in the base board. The first coupling portion is disposed on the first layer. The first coupling portion is electrically coupled to the first portion and the second portion. The first coupling portion is electrically coupled to the ground portion through via holes. The second coupling portion is disposed on the first layer. The second coupling portion is electrically coupled to the first portion and the second portion. The second coupling portion is electrically coupled to the ground portion through the via holes.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers.

Apparatuses and methods including conductive vias of a printed circuit board are described. An example apparatus includes a first layer including a first conductive plate; a component on the first layer, a second layer including a second conductive plate that may be coupled to an external power source; a third layer between the first layer and the second layer, the third layer including a third conductive plate; a first via coupling the first conductive plate to the second conductive plate; and a second via coupled to the first conductive plate. The first conductive plate includes a first portion coupled to the first via and the first conductive plate further includes a second portion coupled to the second via between the first portion and the component. The second via is coupled to either the second conductive plate or the third conductive plate.

Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.

A stacked structure can include a first deposited flexible dielectric layer, a flexible electrical conductor on the first deposited flexible dielectric layer and configured to conduct an electrical signal, and a second deposited flexible dielectric layer on the flexible electrical conductor opposite the first deposited flexible dielectric layer. A housing structure can be coupled to the stacked structure, where the housing structure can include a side wall extending around a perimeter to define an interior region of the housing structure forming a recess that is configured to hold a packaged integrated circuit device and to define an exterior region of the housing structure that is outside the side wall and a flange coupled to a portion of the side wall to cantilever over the exterior region of the housing structure. Other embodiments and aspects of the invention are also disclosed herein.

Apparatuses and methods including conductive vias of a printed circuit board are described. An example apparatus includes a first layer including a first conductive plate; a component on the first layer, a second layer including a second conductive plate that may be coupled to an external power source; a third layer between the first layer and the second layer, the third layer including a third conductive plate; a first via coupling the first conductive plate to the second conductive plate; and a second via coupled to the first conductive plate. The first conductive plate includes a first portion coupled to the first via and the first conductive plate further includes a second portion coupled to the second via between the first portion and the component. The second via is coupled to either the second conductive plate or the third conductive plate.

A ceramic wiring member includes: a main body portion made of ceramic; and an electroconductive portion arranged in contact with the main body portion. The electroconductive portion has a composition including: a first metal component corresponding to a main component, the first metal component being at least any one of W or Mo; at least one second metal component selected from the group consisting of Ni, Co, and Fe at 0.1% or more and 10% or less in total to the first metal component; and a ceramic component. The electroconductive portion has a structure including: an electroconductive phase made of an alloy of the first metal component and the second metal component; and a glass phase, which is dispersed in the electroconductive phase and is made of the ceramic component at 3% or more and 20% or less in area ratio on a cross section of the electroconductive portion.

The electroconductive portion has a structure including: an electroconductive phase, which is made of a metal component containing at least one of W or Mo and has a plurality of air gaps dispersed so as to be separated from each other; and glass phases, which are contained in at least some of the plurality of air gaps and have an area ratio of 3% or more and 20% or less on a cross section of the plate-shaped portion taken in a thickness direction. A proportion of the number of the glass phases, each having an aspect ratio of 1.5 or less, to a total number of the glass phases on the cross section of the plate-shaped portion taken in the thickness direction is 40% or more.

The coil device includes a plurality of printed wiring boards and an adhesive layer. The plurality of printed wiring boards are stacked in a thickness direction of the coil device. Each of the plurality of printed wiring boards includes a base film having a first main surface and a second main surface, and a coil wire formed in a spiral shape on at least one of the first main surface and the second main surface. The adhesive layer is disposed between the plurality of printed wiring boards adjacent to each other in the thickness direction of the coil device. The coil device has a portion that satisfies expression (1).

[00001]$\begin{array}{cc}0.35R1R20.85& \mathrm{Expression}\left(1\right)\end{array}$