A textile electronic device configured to be connected to a conductive zone of a textile, the device including: an electronic circuit; at least a first mechanical and electrical connection means configured to be connected to the conductive zone of a textile; a textile substrate having at least a second electrical connection means, the at least one second electrical connection means being electrically connected to the electronic circuit and to the at least one first mechanical and electrical connection means; and a flexible envelope totally or partially including said electronic circuit, the at least one first mechanical and electrical connection means and the textile substrate, the at least one first mechanical connection means and electric being at least partially accessible through the flexible envelope. Also, a manufacturing method of the textile electronic device.

A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mounted on the first main surface; a first sealing resin that seals the first component and the like; and a shield film that covers an upper surface of the first sealing resin and the like, the shield structure including a top side portion and at least one sidewall portion bent from the top side portion and thus extending therefrom, the top side portion including the top side portion's conductive layer and a magnetic layer therein, the sidewall portion including the sidewall portion's conductive layer therein, the top side portion's conductive layer and the sidewall portion's conductive layer being electrically connected to a ground conductor, the magnetic layer in the top side portion being located over the first component.

An electrical device includes an electrical conductor and a printed circuit board assembly (PCBA). The PCBA includes a planar substrate having first and second primary surfaces. The second primary surface is adjacent to the electrical conductor. A point field detector is mounted to the first primary surface. A magnetic shielding array is constructed of a magnetic material, e.g., having a relative magnetic permeability of about 100-1000. The magnetic shielding array is mounted to or situated on the first and/or second primary surface of the planar substrate, and includes first and second flux shield portions flanking the point field detector. The point field detector and the magnetic shielding array are both located on the same side of the electrical conductor with respect to each other.

The invention describes a method of manufacturing an LED carrier assembly, which method comprises the steps of providing a carrier comprising a mounting surface with mounting pads arranged to receive a number of LED dies; embedding an alignment magnet in the carrier; providing a number of LED dies, wherein an LED die comprises a number of magnetic die pads; and aligning the magnetic die pads to the mounting pads by arranging the LED dies over the mounting surface of the carrier within magnetic range of the alignment magnet. The invention also describes an LED carrier assembly.

An electronic module includes a substrate, electronic components mounted on the substrate, a magnetic body provided on the substrate so as to cover the electronic components, and a metal shield provided on the magnetic body. An electronic circuit is defined using the electronic components. The electronic circuit includes a signal circuit. The metal shield includes ground connection portions connected to a ground electrode of the substrate, and a circuit connection portion connected to the signal circuit at a position different from the ground connection portions.

A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

A flexible screen support structure includes a first flexible board, a second flexible board, a side board, and a number of electromagnets. The second flexible board is arranged opposite to the first flexible board and defines a gap together with the first flexible board. The gap is filled with an electro-rheological fluid. The side board encloses outer peripheral sides of the first and second flexible boards and seals the gap. The electromagnets are secured to the first flexible board and located in the gap, each electromagnet has a support surface attached to the first flexible board and a side surface at an acute angle to the support surface, and the side surfaces of adjacent electromagnets are mutually attached by a magnetic force to cause the first flexible board to roll up. A flexible display screen module is also provided.

A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.

A method and apparatus for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase GaIn eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.