A system and method for coupling is described. The system includes, a printed electronic circuit having one or more conductive traces disposed on a flexible substrate The printed electronic circuit includes one or more magnetic couplers disposed on the flexible substrate. The system includes a magnetic connector having one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers The magnetic connector includes one or more spring-loaded pins each aligned with and electrically coupled to a corresponding one of the one or more conductive traces.

The present invention provides high temperature performing, conductive thermosetting resin compositions.

To provide a magnetic sensor capable of supporting a magnetic block stably and allowing a further size reduction of the sensor chip. A magnetic sensor includes a sensor chip and a magnetic block which are mounted on a circuit board. The sensor chip is mounted on the circuit board such that a mounted surface thereof faces a mounting surface, and the magnetic block is mounted on the circuit board such that first and second surfaces and face an element formation surface and the mounting surface, respectively. The magnetic block has a cutout portion, and some of terminal electrodes E11 to E16 are disposed within a space formed by the cutout portion. According to the present invention, the magnetic block can be supported stably. In addition, the presence of the cutout portion in the magnetic block allows a further size reduction of the sensor chip.

A touch structure including an insulating substrate, an electromagnetic shielding structure layer, a sensing circuit structure layer, a first insulating layer, and a second insulating layer is provided. The electromagnetic shielding structure layer is disposed on the insulating substrate, and located between the insulating substrate and the sensing circuit structure layer. The sensing circuit structure layer is disposed on the insulating substrate, and includes a first sensing circuit layer and a second sensing circuit layer. The first insulating layer is disposed between the electromagnetic shielding structure layer and the first sensing circuit layer. The second insulating layer is disposed between the first sensing circuit layer and the second sensing circuit layer.

A battery pack wherein each battery is mechanically and electrically connected by a magnetic device to a busbar. In case of failure of any accumulator, it is disconnected completely passively because its failure generates an inactivation of the magnetic device. The disconnection causes the gravity drop of the accumulator and the possibly completely passive implementation of an accumulator shunt.

An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.

An electronic circuit (4) comprises at least one electrically conductive portion arranged to a substrate (2) and at least one electrical coupling point (5) determined at the at least one electrically conductive portion. The electronic circuit (4) comprises at the at least one electrical coupling point (5) at least one magnetic and electrically conductive coupling element (6a, 6b, 6c, 6d, 6e, 6f, 6g, 6h, 6i, 6j, 6k, 6l) for providing an electrically conductive coupling point (5) with magnetic fastening force.

An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.

Disclosed herein are communication devices and connected clothing systems. The communication devices comprise a circuit printed on a portion of fabric, the circuit comprising means for transmitting electrical signals to and from a user, a controller electrically pairable to the circuit, and means for attaching the circuit to an item of apparel. Connected clothing systems comprises a communication device as disclosed herein attached to an item of apparel.

A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.