Disclosed herein are communication devices and connected clothing systems. The communication devices comprise a circuit printed on a portion of fabric, the circuit comprising means for transmitting electrical signals to and from a user, a controller electrically pairable to the circuit, and means for attaching the circuit to an item of apparel. Connected clothing systems comprises a communication device as disclosed herein attached to an item of apparel.

A touch structure including an insulating substrate, an electromagnetic shielding structure layer, a sensing circuit structure layer, a first insulating layer, and a second insulating layer is provided. The electromagnetic shielding structure layer is disposed on the insulating substrate, and located between the insulating substrate and the sensing circuit structure layer. The sensing circuit structure layer is disposed on the insulating substrate, and includes a first sensing circuit layer and a second sensing circuit layer. The first insulating layer is disposed between the electromagnetic shielding structure layer and the first sensing circuit layer. The second insulating layer is disposed between the first sensing circuit layer and the second sensing circuit layer.

Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

A flexible screen support structure includes a first flexible board, a second flexible board, a side board, and a number of electromagnets. The second flexible board is arranged opposite to the first flexible board and defines a gap together with the first flexible board. The gap is filled with an electro-rheological fluid. The side board encloses outer peripheral sides of the first and second flexible boards and seals the gap. The electromagnets are secured to the first flexible board and located in the gap, each electromagnet has a support surface attached to the first flexible board and a side surface at an acute angle to the support surface, and the side surfaces of adjacent electromagnets are mutually attached by a magnetic force to cause the first flexible board to roll up. A flexible display screen module is also provided.

A support structure for supporting a flexible display screen includes a first flexible board, a second flexible board, a side board, and a number of electromagnets. The second flexible board is arranged opposite to the first flexible board and defines a gap together with the first flexible board. The gap is filled with an electro-rheological fluid. The side board encloses outer peripheral sides of the first and second flexible boards and seals the gap. The electromagnets are secured to the first flexible board and located in the gap, each electromagnet has a support surface attached to the first flexible board and a side surface at an acute angle to the support surface, and the side surfaces of adjacent electromagnets are mutually attached by a magnetic force to cause the first flexible board to roll up. A flexible display screen module is also provided.

A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.

An item may be formed from layers of material such as leatherboard layers. A leatherboard layer may include fibrous natural material such as leather or paper embedded in polymer. Portions of the leatherboard layer can be locally modified by incorporation of filler material with desired properties. The filler material may include magnetic particles, conductive particles, or other material. By incorporating the filler material in localized portions of the leatherboard layer, integral electrodes or magnets may be formed. The leatherboard layer may also include embedded circuitry. Items such as enclosures and other items may be formed from the leatherboard layer. The leatherboard layer in an item may include locally modified regions such as magnet regions that are configured to form a closure or other structures that interact with each other.

An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.

An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.

An electronic system for identifying an article can include a printed memory having a plurality of contact pads electrically coupled to a plurality of landing pads positioned on a first side of a printed circuit board (PCB) substrate. The plurality of landing pads can be electrically coupled to a plurality of endless, concentric contact lines positioned on a second side of the PCB substrate through a plurality of vias that extend through a thickness of the PCB substrate and a plurality of traces that electrically couple the plurality of vias with the plurality of landing pads. To perform a memory operation on the printed memory, contact probes of a reader are physically and electrically contacted with the plurality of concentric contact lines. In some implementations, the memory operation can be performed on the printed memory irrespective of a rotational orientation of the printed memory relative to the reader.