An apparatus for an electronic power steering system includes a printed circuit board and a first sensor. The printed circuit board comprising: a first surface and a second surface opposite the first surface; a first processor section extending in a first direction on the first surface; a second processor section extending in a second direction opposite the first direction on the second surface; and a void disposed between the first surface and the second surface, the first processor section and the second processor section being separated by the void.

A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.

Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose directly embedded a smart module with a lighting fixture utilizing metal core PCB (MCPCB).

The application discloses a connecting assembly, a battery module, a battery group, and a device using the battery module as a power supply. The connecting assembly includes a plurality of connecting sheets, a sampling assembly, and an insulating film, where the plurality of connecting sheets are configured to connect battery cells of the battery module; the sampling assembly includes a circuit board and a sampling terminal connected to the circuit board; the sampling terminal is connected to the plurality of connecting sheets, the insulating film is provided at one side of the sampling assembly and the plurality of connecting sheets, and the insulating film connects the sampling assembly to the plurality of connecting sheets to form an integral structure with the sampling assembly and the plurality of connecting sheets, an insulating film through hole is provided in a region of the sampling assembly covered by the insulating film.

The application discloses a connecting assembly, a battery module, a battery group, and a device using the battery module as a power supply. The connecting assembly includes a plurality of connecting sheets, a sampling assembly, and an insulating film, where the plurality of connecting sheets are configured to connect battery cells of the battery module; the sampling assembly includes a circuit board and a sampling terminal connected to the circuit board; the sampling terminal is connected to the plurality of connecting sheets, the insulating film is provided at one side of the sampling assembly and the plurality of connecting sheets, and the insulating film connects the sampling assembly to the plurality of connecting sheets to form an integral structure with the sampling assembly and the plurality of connecting sheets, an insulating film through hole is provided in a region of the sampling assembly covered by the insulating film.

There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder. The printed circuit board further includes a coating film (31) that is disposed at least on a front end side of the connection portion (23a) than a portion where the second electrodes (19 and 25) are joined to the first electrodes (7 and 9) by the solder.

A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer.

A polyhedral LED display screen is provided and includes multiple cabinet main frames. Each the cabinet main frame is formed with an accommodating cavity. A side of each cabinet main frame is provided with a flexible PCB, an outer side of the flexible PCB facing away from the cabinet main frame is disposed with LED lamp beads, an inner side of the flexible PCB facing towards the cabinet main frame is magnetically connected to the cabinet main frame, and the cabinet main frames are connected to each other to form a regular dodecahedron sphere. The multiple cabinet main frames can be completely covered by the flexible PCBs, a missing display at an end point in the prior art is eliminated, design numbers and complexities of the cabinet main frames and the flexible PCBs are reduced, and an installation of the cabinet main frames becomes more convenient.

A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.

A composite material incorporates multi-compartment microcapsules that produce heat when subject to a stimulus such as a compressive force or a magnetic field. The stimulus ruptures an isolating structure within the multi-compartment microcapsule, allowing reactants within the multi-compartment microcapsule to produce heat from an exothermic reaction. In some embodiments, the composite material is a laminate used in the manufacture of multi-layer printed circuit boards (PCBs) and provides heat during the curing process of the multi-layer PCBs to ensure a consistent thermal gradient in the multi-layer product.