Method for connecting a printed circuit board (1) to a coaxial cable (3), wherein the coaxial cable (3) has an internal conductor (5) which is surrounded by a dielectric (7) which, in turn, is surrounded by a shield (6), wherein the dielectric (7) is surrounded by an outer casing (4), wherein the internal conductor (5) is soldered to a contact point (8) on the printed circuit board (1) for the purpose of making electrical contact, characterized in that the printed circuit board (1) has a recess (2) which starts from the surface of said printed circuit board, and the end region of the outer casing (4) of the coaxial cable (3) is inserted at least partially into the recess (2).

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

An electronic device for tiling another electronic device of the present disclosure includes a supporting substrate having a first edge and a second edge, and a flexible substrate disposed on the supporting substrate, wherein the flexible substrate extends beyond the first edge and the second edge so as to define a first extension region and a second extension region of the flexible substrate, respectively.

Embodiments of the present disclosure provide a method and apparatus for illuminating. An exemplary apparatus includes a substrate having a longitudinal axis, and a first plurality of spaced apart fingers extending perpendicular to the longitudinal axis from a first side of the substrate. The apparatus further includes second plurality of spaced apart fingers extending perpendicular to the longitudinal axis of a second side of the substrate, wherein the first side of the substrate is opposite the second side of the substrate. The apparatus still further includes a first plurality of spaced apart lighting elements located on a third side of the substrate, wherein the first plurality of spaced apart lighting elements are spaced along the longitudinal axis of the substrate, and a second plurality of spaced apart lighting elements located on a fourth side of the substrate.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

A display device includes: a display panel which displays an image with light and a drive unit which is electrically connected to the display panel and drives the display panel. The drive unit includes a drive circuit board and a drive circuit film. The drive circuit board overlaps the display panel, generates a drive signal to drive the display panel and defines a receiving hole therein. The drive circuit film electrically connects the display panel to the drive circuit board and is bent from the display panel toward the drive circuit board. The drive circuit film includes a driver chip which provides a control signal in response to the drive signal from the drive circuit board. The driver chip is received in the receiving hole defined in the drive circuit board.