H05K2201/09145

Packaging photon building blocks with top side connections and interconnect structure
10347807 · 2019-07-09 · ·

Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

FLEXIBLE PRINTED CIRCUIT APPLIED TO DISPLAY PANEL AND DISPLAY DEVICE
20190208627 · 2019-07-04 ·

The present application discloses a Flexible Printed Circuit (FPC) applied to a display panel, including: a first connecting edge connected to the display panel; and a second connecting edge connected to a control circuit board; both ends of the first connecting edge and the second connecting edge are connected and provided with a side edge on which a stress dispersion part is provided; the stress dispersion part includes a recess provided on the side edge, and the profile of the recess is an are segment; the recess is provided on the side edge; and one end of the recess is connected to an endpoint of the first connecting edge, and the other end of the recess is connected to an endpoint of the second connecting edge.

DISPLAY MODULE AND METHOD FOR COATING THE SAME
20190200422 · 2019-06-27 ·

The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

Substrate unit and substrate assembly, and camera module using same
10334743 · 2019-06-25 · ·

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to prevent interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Motherboard of computer

A motherboard of a computer is provided. The motherboard of a computer includes a main body, a notch formed at a side edge of the main body, an auxiliary device, and a fixing device formed adjacent to the notch to fix the auxiliary device in the notch, wherein the auxiliary device is a light guiding device including patterns.

SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME
20240188229 · 2024-06-06 ·

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Electrical terminal having a cage clamp for wire termination

Embodiments of the invention provide an electrical terminal that provides wire termination at an edge of a printed circuit board. The electrical terminal includes a terminal body having a first corner, a cage clamp in the terminal body and defining a wire insert axis and a screw insert axis, and a base supporting the terminal body on the printed circuit board. The base is angled so that the first corner is aligned along a front plane defined along the edge of the printed circuit board.

CABLE CONNECTOR FOR COAXIAL CABLE ON THICK PRINTED-CIRCUIT BOARD
20190148853 · 2019-05-16 ·

Method for connecting a printed circuit board (1) to a coaxial cable (3), wherein the coaxial cable (3) has an internal conductor (5) which is surrounded by a dielectric (7) which, in turn, is surrounded by a shield (6), wherein the dielectric (7) is surrounded by an outer casing (4), wherein the internal conductor (5) is soldered to a contact point (8) on the printed circuit board (1) for the purpose of making electrical contact, characterized in that the printed circuit board (1) has a recess (2) which starts from the surface of said printed circuit board, and the end region of the outer casing (4) of the coaxial cable (3) is inserted at least partially into the recess (2).

PRINTED CIRCUIT BOARD WITH EMBEDDED LATERAL CONNECTOR
20190148856 · 2019-05-16 ·

Printed circuit boards (PCBs) may include embedded lateral connectors. The embedded lateral connectors may be configured to enable components to quickly couple to or plug into a PCB, thus saving time to form connections. The embedded lateral connectors may also reduce weight and/or size by avoiding need for bulky tradition collections with conventional components (e.g., solders, external pin connectors, etc.). The connectors may include male connectors, female connectors, and/or mounting connectors. The connectors may be configured to connect multiple PCBs together, such as using a stacked configuration, which may enable reducing a volume of space needed in a housing for the PCBs.

PERIPHERAL END FACE ATTACHMENT OF EXPOSED COPPER LAYERS OF A FIRST PRINTED CIRCUIT BOARD TO THE SURFACE OF A SECOND PRINTED CIRCUIT BOARD BY SURFACE MOUNT ASSEMBLY
20190141830 · 2019-05-09 ·

A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.