A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.

A lens driving device is provided, including a base, a holder, a first driving mechanism disposed on the first side of the base, a second driving mechanism disposed on the second side of the base opposite the first side, and a conductive member disposed on the base. The holder is configured to sustain a lens. The first driving mechanism is configured to force the holder to move along the optical axis of the lens. The second driving mechanism includes a circuit board assembly and a shape memory alloy (SMA) wire assembly configured to force the base to move in the plane perpendicular to the optical axis. The conductive member and the circuit board assembly are connected at an electrical connection point, and the SMA wire assembly is closer to the light-incident end of the lens with respect to the electrical connection point.

A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.

To provide a connected structure of a substrate and an electric wire with high connection reliability even when a carbon nanotube wire with an average diameter of 0.05 mm to 3.00 mm is used as the electric wire. The connected structure of the substrate and the carbon nanotube wire includes a substrate; a carbon nanotube wire made of one or more carbon nanotube aggregates each including a plurality of carbon nanotubes, the carbon nanotube wire having an average diameter of 0.05 mm to 3.00 mm; a conductive fixing member, part of which is provided between the substrate and the carbon nanotube wire; and a conductive member that electrically connects the carbon nanotube wire and the fixing member.

Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.