A power interface may include a housing, a connection body, and a second stopping plate. A first stopping plate may be arranged in the housing. The connection body may be arranged in the housing. An engaging flange may be arranged on the connection body. A second stopping plate may be attached on an inner face of the housing along a circumference direction of the housing. The second stopping plate may be spaced apart from the first stopping plate. The engaging flange may be sandwiched between the first stopping plate and the second stopping plate. A mobile terminal and a method for manufacturing a power interface are also provided.

A strap for a wearable device comprises a printed circuit board (PCB) located within said strap. The PCB comprises a first electronic component, coupled to a first flexible portion. The first electronic component is mounted to a cage, the cage comprising a cage pivot mount. The flexible portion is under tension and urges said first electronic component towards said cage pivot mount such that a pivotable connection is formed between said cage and said first electronic component. Also disclosed is a method of manufacture of the strap.

A power interface may include a housing, a connection body, and a second stopping plate. A first stopping plate may be arranged in the housing. The connection body may be arranged in the housing. An engaging flange may be arranged on the connection body. A second stopping plate may be attached on an inner face of the housing along a circumference direction of the housing. The second stopping plate may be spaced apart from the first stopping plate. The engaging flange may be sandwiched between the first stopping plate and the second stopping plate. A mobile terminal and a method for manufacturing a power interface are also provided.

A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

The present disclosure relates to a vertical connection type contact terminal of a wire to board connector, which enables a wire to be connected in a vertical direction, and the present disclosure has a terminal formed in a horseshoe shape (?) by bending both ends of a back plate of a sheet shape toward a front surface and having one side opened, includes: one pair of support plates which bend from both ends of the back plate and define a wire insertion space therebetween, and have mounting portions formed on lower ends thereof to be mounted on a substrate; and one pair of connection plates which bend from upper ends of the one pair of support plates toward the wire insertion space inside, and connect and lock a wire, and is mounted on the substrate in an upright position to allow the wire to be connected in a vertical direction.

Disclosed herein is an electronic device and printed circuit board (PCB). The electronic device includes: a housing, the PCB disposed in the housing, a first shielding part including a first shielding member having a closed shape, disposed on a first surface of the PCB, a second shielding part including a second shielding member having a closed shape, a shielding cover covering the first shielding part and the second shielding part, wherein the first shielding member and the second shielding member contact each other at a first location and a second location on the first surface, wherein a third shielding part is defined between the first shielding member and the second shielding member, and wherein the shielding cover is disposed to correspond to the first shielding part, the second shielding part, and the third shielding part.

A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.

A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.

A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.